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US3484533A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for fabricating semiconductor package and resulting article of manufacture

Assignee: Texas Instruments Inc
•
Filing: 1966-09-29
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Granted: 1969-12-16
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Expires: 1986-09-29
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Abstract

No abstract record available.

Inventors

  • 👤 John E Kauffman

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-24 20:55
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/134; H10W70/00; H10W70/40; H10W70/421; H10W72/00; H10W72/50; H10W72/531; H10W72/536; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12528

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

US2057266A Cited
US2615857A Cited
US3317287A Cited
US3281628A Cited
US3320351A Cited
US3351701A Cited
US3340348A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1972-12-15 1973-06-16 1973-12-16 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1976-12-15 1977-06-16 1977-12-16 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1980-12-15 1981-06-16 1981-12-16 $7700.00 Window Closed / Lapsed

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