US3480412A
Expired / Lapsed
US
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Method of fabrication of solder reflow interconnections for face down bonding of semiconductor devices
Assignee: Fairchild Semiconductor Corp
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Filing: 1968-09-03
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Granted: 1969-11-25
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Expires: 1988-09-03
Abstract
No abstract record available.
Inventors
- 👤 Edward F Duffek Jr
- 👤 Ilan A Blech
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 17:15
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; H10P; H10P14/00; H10P14/40; H10P14/46; H10W72/01; H10W72/012; H10W72/071; H10W72/072; H10W72/07231; H10W72/07232; H10W72/07233; H10W72/07236; H10W72/251; H10W72/252; H10W72/90; H10W72/951; H10W72/952; Y; Y10; Y10S; Y10S205/00; Y10S205/917; Y10S428/00; Y10S428/922; Y10S428/923; Y10S428/924; Y10S428/926; Y10S428/9335; Y10S428/934; Y10S428/935; Y10S428/938; Y10T; Y10T428/00; Y10T428/12; Y10T428/12389; Y10T428/12396; Y10T428/12493; Y10T428/12528; Y10T428/12535; Y10T428/12639; Y10T428/12646; Y10T428/12681; Y10T428/12708; Y10T428/12715; Y10T428/12736; Y10T428/1275; Y10T428/12771; Y10T428/12785; Y10T428/12792; Y10T428/12861; Y10T428/12889
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1972-11-24 | 1973-05-26 | 1973-11-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1976-11-24 | 1977-05-26 | 1977-11-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1980-11-24 | 1981-05-26 | 1981-11-25 | $7700.00 | Window Closed / Lapsed |