Patent US3439855A successfully refreshed from Google Patents.
US3439855A
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Method and apparatus for thermally bonding semiconductor components to carriers
Assignee: Siemens AG
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Filing: 1966-07-13
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Granted: 1969-04-22
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Expires: 1986-07-13
Abstract
No abstract record available.
Inventors
- 👤 Heinz-Herbert Arndt
- 👤 Jurgen Schadel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 05:32
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; H10W; H10W72/00; H10W72/30; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
US3197608A
Cited
US3255511A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1972-04-21 | 1972-10-21 | 1973-04-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1976-04-21 | 1976-10-21 | 1977-04-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1980-04-21 | 1980-10-21 | 1981-04-22 | $7700.00 | Window Closed / Lapsed |