US3436327A
Expired / Lapsed
US
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Selective sputtering rate circuit forming process
Assignee: Collins Radio Co
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Filing: 1966-07-18
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Granted: 1969-04-01
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Expires: 1986-07-18
Abstract
No abstract record available.
Inventors
- 👤 William L Shockley
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 04:25
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/32; H01J37/34; C; C23; C23C; C23C14/00; C23C14/22; C23C14/34; C23C14/35; C23F; C23F4/00; C23F4/02
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
131 words
IN THE PRODUCTION OF THIN FILM CIRCUITRY, PATTERN FORMING OF CIRCUIT FILMS THROUGH SELECTIVE REMOVAL OF CIRCUIT THIN FILM METAL AS DETERMINED BY THE DIFFERENT SPUTTER RATE OF A PLURALITY OF MATERIALS AND THE PATTERNS OF ORIGINAL DEPOSITION AND OVERLAY OF THE MATERIALS; WHEREIN AT LEAST TWO MATERIALS USED IN FORMING THE CIRCUIT HAVE DIFFERENT SPUTTERING REMOVAL RATES WHEN SUBMITTED TO SPUTTERING AS A CATHODE IN A SPUTTERING PROCESS CIRCUIT; THE THIN FILM CIRCUIT BUILDUP BEING PROCESSED IS POSITIONED AS A CATHODE IN A SPUTTERING PROCESS CIRCUIT AND A VOLTAGE IS APPLIED FOR MAINTAINING THE SPUTTERING PROCESS REMOVAL OF METAL FROM THE CIRCUIT BUILDUP FOR A PROCESS INTERVAL OF TIME PROVIDING METAL REMOVAL AS DESIRED; AND WHEREIN ONE OF SAID MATERIALS IS TANTALUM; AND WHEREIN ANOTHER OF SAID MATERIALS IS ALUMINUM.
Claim 2
Dependent Claim
131 words
IN THE PRODUCTION OF THIN FILM CIRCUITRY, PATTERN FORMING OF CIRCUIT FILMS THROUGH SELECTIVE REMOVAL OF CIRCUIT THIN FILM METAL AS DETERMINED BY THE DIFFERENT SPUTTER RATE OF A PLURALITY OF MATERIALS AND THE PATTERNS OF ORIGINAL DEPOSITION AND OVERLAY OF THE MATERIALS; WHEREIN AT LEAST TWO MATERIALS USED IN FORMING THE CIRCUIT HAVE DIFFERENT SPUTTERING REMOVAL RATES WHEN SUBMITTED TO SPUTTERING AS A CATHODE IN A SPUTTERING PROCESS CIRCUIT; THE THIN FILM CIRCUIT BUILDUP BEING PROCESSED IS POSITIONED AS A CATHODE IN A SPUTTERING PROCESS CIRCUIT AND A VOLTAGE IS APPLIED FOR MAINTAINING THE SPUTTERING PROCESS REMOVAL OF METAL FROM THE CIRCUIT BUILDUP FOR A PROCESS INTERVAL OF TIME PROVIDING METAL REMOVAL AS DESIRED; AND WHEREIN ONE OF SAID MATERIALS IS TANTALUM; AND WHEREIN ANOTHER OF SAID MATERIALS IS ALUMINUM.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1972-03-31 | 1972-09-30 | 1973-04-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1976-03-31 | 1976-09-30 | 1977-04-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1980-03-31 | 1980-09-30 | 1981-04-01 | $7700.00 | Window Closed / Lapsed |