Method of making hermetically sealed thin film module

Claim 1

A METHOD OF MAKING A HERMETICALLY SEALED THIN FILM ELECTRIC CIRCUIT MODULE COMPRISING: PRESS FORMING A CUP-SHAPED MEMBER OF METAL; AFFIXING A PLURALITY OF METAL PINS AND CAPACITOR BLOCKS TO THE BOTTOM OF SAID CUP-SHAPED MEMBER TO EXTEND UPWARDLY THEREOF TO THE PLANE OF THE CUP RIM, SAID CUP-SHAPED MEMBER, METAL PINS, AND CAPACITOR BLOCKS HAVING THE SAME THERMAL EXPANDING RATES; HEATING A VITREOUS SUBSTRATE BLANK OF THE SAME THERMAL EXPANDING RATE TO A MOLTEN STATE AND PRESSING SAID VITREOUS SUBSTRATE INTO SAID CUP CAUSING SAID VITREOUS SUBSTRATE TO FLOW AROUND SAID PLURALITY OF METAL PINS AND CAPACITOR BLOCKS AND TO HERMETICALLY SEAL THERETO AND TO SAID CUP UPON COOLING; ETCHING OUT PORTIONS OF SAID METAL CUP BOTTOM SURROUNDING SAID METAL PINS AND CAPACITOR BLOCKS PROVIDING ELECTRIC INSULATION OF SAID METAL PINS AND BLOCKS FROM SAID METAL CUP AND FROM EACH OTHER; LAP-POLISHING THE EXPOSED SURFACE OF SAID VITREOUS SUBSTRATE PRODUCING A COMMON OPTICAL PLANE FOR SAID VITREOUS SUBSTRATE, SAID METAL PINS, AND SAID CAPACITOR BLOCKS; THIN FILM VACUUM DEPOSITING A THIN FILM CIRCUIT ON SAID EXPOSED SURFACE OF SAID VITREOUS SUBSTRATE CONNECTING SAID METAL PINS AND CAPACITOR BLOCKS AT THE THIN FILM CIRCUIT TERMINATIONS; RESISTANCE WELDING DISCRETE TRANSISTORS AND DIODES TO SAID THIN FILM CIRCUIT TERMINATIONS AT SAID METAL PINS; FORMING A MULTIPLE CONNECTOR MEANS ON THE EXPOSED ENDS OF THE METAL PINS EXPOSED BY SAID ETCHING AWAY OF SAID METAL CUP; AND WELDING A METAL COVER ON THE PERIPHERY OF SAID METAL CUP TO HERMETICALLY SEAL IN SAID THIN FILM CIRCUITRY WHEREBY A THIN FOLM MOISTURE RESISTAND MODULE IS PROVIDED FOR ELECTRIC PLUG-IN USE.

Claim 2

A METHOD OF MAKING A HERMETICALLY SEALED THIN FILM ELECTRIC CIRCUIT MODULE COMPRISING: PRESS FORMING A CUP-SHAPED MEMBER OF METAL; AFFIXING A PLURALITY OF METAL PINS AND CAPACITOR BLOCKS TO THE BOTTOM OF SAID CUP-SHAPED MEMBER TO EXTEND UPWARDLY THEREOF TO THE PLANE OF THE CUP RIM, SAID CUP-SHAPED MEMBER, METAL PINS, AND CAPACITOR BLOCKS HAVING THE SAME THERMAL EXPANDING RATES; HEATING A VITREOUS SUBSTRATE BLANK OF THE SAME THERMAL EXPANDING RATE TO A MOLTEN STATE AND PRESSING SAID VITREOUS SUBSTRATE INTO SAID CUP CAUSING SAID VITREOUS SUBSTRATE TO FLOW AROUND SAID PLURALITY OF METAL PINS AND CAPACITOR BLOCKS AND TO HERMETICALLY SEAL THERETO AND TO SAID CUP UPON COOLING; ETCHING OUT PORTIONS OF SAID METAL CUP BOTTOM SURROUNDING SAID METAL PINS AND CAPACITOR BLOCKS PROVIDING ELECTRIC INSULATION OF SAID METAL PINS AND BLOCKS FROM SAID METAL CUP AND FROM EACH OTHER; LAP-POLISHING THE EXPOSED SURFACE OF SAID VITREOUS SUBSTRATE PRODUCING A COMMON OPTICAL PLANE FOR SAID VITREOUS SUBSTRATE, SAID METAL PINS, AND SAID CAPACITOR BLOCKS; THIN FILM VACUUM DEPOSITING A THIN FILM CIRCUIT ON SAID EXPOSED SURFACE OF SAID VITREOUS SUBSTRATE CONNECTING SAID METAL PINS AND CAPACITOR BLOCKS AT THE THIN FILM CIRCUIT TERMINATIONS; RESISTANCE WELDING DISCRETE TRANSISTORS AND DIODES TO SAID THIN FILM CIRCUIT TERMINATIONS AT SAID METAL PINS; FORMING A MULTIPLE CONNECTOR MEANS ON THE EXPOSED ENDS OF THE METAL PINS EXPOSED BY SAID ETCHING AWAY OF SAID METAL CUP; AND WELDING A METAL COVER ON THE PERIPHERY OF SAID METAL CUP TO HERMETICALLY SEAL IN SAID THIN FILM CIRCUITRY WHEREBY A THIN FOLM MOISTURE RESISTAND MODULE IS PROVIDED FOR ELECTRIC PLUG-IN USE.