Patent US3397084A successfully refreshed from Google Patents.
US3397084A
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Method for producing superconductive layers
Assignee: Siemens AG
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Filing: 1965-10-20
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Granted: 1968-08-13
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Expires: 1985-10-20
Abstract
No abstract record available.
Inventors
- 👤 Krieglstein Walter
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 05:59
CPC Classifications
C; C23; C23C; C23C14/00; C23C14/22; C23C14/56; C23C14/562; C23C10/00; C23C10/28; C23C14/06; C23C14/14; C23C14/16; C23C14/58; C23C14/5806; C23C14/5893; C23C26/00; C23C28/00; C23C28/02; C23C28/023; H; H01; H01F; H01F6/00; H01F6/06; H10; H10N; H10N60/00; H10N60/01; H10N60/0184; Y; Y10; Y10S; Y10S428/00; Y10S428/922; Y10S428/9265; Y10S428/93; Y10S428/9335; Y10S428/934; Y10S428/937; Y10S428/938; Y10S505/00; Y10S505/80; Y10S505/815; Y10S505/818; Y10S505/819; Y10S505/825; Y10S505/917; Y10S505/918; Y10S505/919; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49014
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
132 words
A METHOD FOR PRODUCING A LAYER OF TWO-COMPONENT SUPERCONDUCTIVE INTERMETALLIC COMPOUND ON A SUBSTRATE STRUCTURE COMPRISING THE HIGHER MELTING COMPONENT OF SAID COMPOUND WHICH COMPRISES THE STEPS OF DEPOSITING A LAYER OF THE LOWER MELTING COMPONENT OF SAID COMPOUND ON SAID SUBSTRATE, DEPOSITING A LAYER OF A COVER METAL ON SAID LOWER MELTING COMPONENT, SAID LAST NAMED METAL HAVING A MELTING POINT WHICH IS HIGHER THAN THE DIFUSION TEMPERATURE NECESSARY TO FORM SAID INTERMETALLIC COMPOUND FROM SAID TWO COMPONENTS AND WHICH DOES NOT TEND TO ALLOY WITH OR FORM A COMPOUND WITH SAIDL LOWER MELTING COMPONENT AT SAID DIFFUSION TEMPERATURE, AND HEATING SAID COATED SUBSTRATE STRUCTURE AT A TEMPERATURE UNDER INERT CONDITIONS IN WHICH SAID LOWER MELTING COMPONENT DIFFUSES INTO SAID SUBSTRATE COMPONENT TO FORM SAID INTERMETALLIC COMPOUND LAYER ON SAID SUBSTRATE.
Claim 2
Independent Claim
132 words
A METHOD FOR PRODUCING A LAYER OF TWO-COMPONENT SUPERCONDUCTIVE INTERMETALLIC COMPOUND ON A SUBSTRATE STRUCTURE COMPRISING THE HIGHER MELTING COMPONENT OF SAID COMPOUND WHICH COMPRISES THE STEPS OF DEPOSITING A LAYER OF THE LOWER MELTING COMPONENT OF SAID COMPOUND ON SAID SUBSTRATE, DEPOSITING A LAYER OF A COVER METAL ON SAID LOWER MELTING COMPONENT, SAID LAST NAMED METAL HAVING A MELTING POINT WHICH IS HIGHER THAN THE DIFUSION TEMPERATURE NECESSARY TO FORM SAID INTERMETALLIC COMPOUND FROM SAID TWO COMPONENTS AND WHICH DOES NOT TEND TO ALLOY WITH OR FORM A COMPOUND WITH SAIDL LOWER MELTING COMPONENT AT SAID DIFFUSION TEMPERATURE, AND HEATING SAID COATED SUBSTRATE STRUCTURE AT A TEMPERATURE UNDER INERT CONDITIONS IN WHICH SAID LOWER MELTING COMPONENT DIFFUSES INTO SAID SUBSTRATE COMPONENT TO FORM SAID INTERMETALLIC COMPOUND LAYER ON SAID SUBSTRATE.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1971-08-13 | 1972-02-12 | 1972-08-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1975-08-13 | 1976-02-12 | 1976-08-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1979-08-13 | 1980-02-12 | 1980-08-13 | $7700.00 | Window Closed / Lapsed |