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US3384518A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for making semiconductor devices

Assignee: Panasonic Holdings Corp
•
Filing: 1965-09-30
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Granted: 1968-05-21
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Expires: 1985-09-30
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Abstract

No abstract record available.

Inventors

  • 👤 Shoda Koichiro
  • 👤 Moriyama Kyoji

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 22:37
CPC Classifications
H; H10; H10P; H10P95/00; C; C23; C23C; C23C2/00; C23C2/14; H10P95/50; Y; Y10; Y10S; Y10S148/00; Y10S148/05; Y10S148/151; Y10S438/00; Y10S438/955

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 153 words
A METHOD FOR MAKING SEMICONDUCTOR DEVICE COMPRISING THE STEPS OF FORMING A THIN LAYER OF INERT COATING MATERIAL ON THE SURFACE OF A SEMICONDUCTOR WAFER, FORMING OPENINGS OF DESIRED CONTACT SHAPE THROUGH PORTIONS OF THE SAID COATING LAYER, AND IMMERSING THE SAID SEMICONDUCTOR WAFER FOR A SHORT IME IN A MOLTEN ALLOY BATH, WHICH IS PREPARED BY HEATING TO MELT AN ALLOYING MATERIAL AND TO WHICH ULTRASONIC VIBRATION IF CONTINUSOULY IMPARTED, THEREBY CAUSING THOSE PROTIONS OF THE SAID SEMICONDUCTOR WHICH ARE EXPOSED THROUGH THE OPENINGS THROUGH SAID COATING LAYER ON THE SAID SEMICONDUCTOR WAFER TO DISSOLVE INTO THE MOLTEN ALLOYING MATERIAL IN THE SAID ALLOY BATH BY SUCH AN AMOUNT AS TO PROVIDE RECESSES OF A CERTAIN DEPTH AND CAUSING THE SAID ALLOYING MATERIAL AND THE SAID SEMICONDUCTOR TO ALLOY WITH EACH OTHER TO FORM A RECRYSTALLIZED LAYER CAOVERING THE ENTIRE SURFACE OF EACH PRECESS PROVIDED BY THE DISSOLUTION OF THE SAID SEMICONDUCTOR.
Claim 2
Independent Claim 153 words
A METHOD FOR MAKING SEMICONDUCTOR DEVICE COMPRISING THE STEPS OF FORMING A THIN LAYER OF INERT COATING MATERIAL ON THE SURFACE OF A SEMICONDUCTOR WAFER, FORMING OPENINGS OF DESIRED CONTACT SHAPE THROUGH PORTIONS OF THE SAID COATING LAYER, AND IMMERSING THE SAID SEMICONDUCTOR WAFER FOR A SHORT IME IN A MOLTEN ALLOY BATH, WHICH IS PREPARED BY HEATING TO MELT AN ALLOYING MATERIAL AND TO WHICH ULTRASONIC VIBRATION IF CONTINUSOULY IMPARTED, THEREBY CAUSING THOSE PROTIONS OF THE SAID SEMICONDUCTOR WHICH ARE EXPOSED THROUGH THE OPENINGS THROUGH SAID COATING LAYER ON THE SAID SEMICONDUCTOR WAFER TO DISSOLVE INTO THE MOLTEN ALLOYING MATERIAL IN THE SAID ALLOY BATH BY SUCH AN AMOUNT AS TO PROVIDE RECESSES OF A CERTAIN DEPTH AND CAUSING THE SAID ALLOYING MATERIAL AND THE SAID SEMICONDUCTOR TO ALLOY WITH EACH OTHER TO FORM A RECRYSTALLIZED LAYER CAOVERING THE ENTIRE SURFACE OF EACH PRECESS PROVIDED BY THE DISSOLUTION OF THE SAID SEMICONDUCTOR.

References Cited (Backward Citations)

US3192082A Cited
US3219497A Cited
US3272669A Cited
US3306835A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1971-05-21 1971-11-20 1972-05-21 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1975-05-21 1975-11-20 1976-05-21 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1979-05-21 1979-11-20 1980-05-21 $7700.00 Window Closed / Lapsed

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