US3272669A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of simultaneously fabricating a plurality of semiconductor p-nu junction devices
Assignee: International Business Machines Corp
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Filing: 1963-08-19
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Granted: 1966-09-13
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Expires: 1983-08-19
Abstract
No abstract record available.
Inventors
- 👤 Samuel S Im
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 09:51
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; C; C23; C23C; C23C10/00; C23C10/18; C23C10/20; C23C10/22; C30; C30B; C30B31/00; C30B31/02; H10D; H10D99/00; H10P; H10P95/00; H10W74/00; H10W74/40; H10W74/43; Y; Y10; Y10S; Y10S148/00; Y10S148/107; Y10S438/00; Y10S438/979
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
167 words
THE METHOD OF SIMULTANEOUSLY FABRICATING A PLURALITY OF SEMICONDUCTOR PN JUNCTION DEVICES COMPRISING: ESTABLISHING ON SELECTED PORTIONS OF A SURFACE OF A SEMICONDUCTOR BODY OF ONE CONDUCTIVITY TYPE A PLURALITY OF ADHERENT THIN METAL FILM MEMBERS; INTRODUCING SAID BODY AND SAID MEMBERS INTO A BATH OF A MOLTEN MATERIAL WHICH HAS A TEMPERATURE LESS THAN THE MELTING POINT OF SAID BODY AND COMPRISES (A) A CONDUCTIVITY-DIRECTING IMPURITY THAT IS OF A TYPE OPPOSITE TO THAT OF SAID BODY AND HAS AN AFFINITY FOR THE METAL OF SAID MEMBERS AND (B) A QUANTITY OF SAID METAL WHICH SUBSTANTIALLY SATURATES SAID BATH, WHEREBY PARTICLES OF SAID MATERIAL ADHERE TO SAID MEMBERS; REMOVING SAID BODY, MEMBERS AND PARTICLES FROM SAID BATH AND COOLING THE ASSEMBLY SO THAT SAID PARTICLES ARE BONDED TO SAID MEMBERS; AND HEATING SAID ASSEMBLY TO THE ALLOYING TEMPERATURE OF THE MATERIALS THEREOF AND THEREAFTER COOLING SAID ASSEMBLY TO FORM ON SAID BODY A PLURALITY OF PN JUNCTIONS AND RECRYSTALLIZED SEMICONDUCTOR REGIONS OF THE OPPOSITE CONDUCTIVITY TYPE.
Claim 2
Independent Claim
167 words
THE METHOD OF SIMULTANEOUSLY FABRICATING A PLURALITY OF SEMICONDUCTOR PN JUNCTION DEVICES COMPRISING: ESTABLISHING ON SELECTED PORTIONS OF A SURFACE OF A SEMICONDUCTOR BODY OF ONE CONDUCTIVITY TYPE A PLURALITY OF ADHERENT THIN METAL FILM MEMBERS; INTRODUCING SAID BODY AND SAID MEMBERS INTO A BATH OF A MOLTEN MATERIAL WHICH HAS A TEMPERATURE LESS THAN THE MELTING POINT OF SAID BODY AND COMPRISES (A) A CONDUCTIVITY-DIRECTING IMPURITY THAT IS OF A TYPE OPPOSITE TO THAT OF SAID BODY AND HAS AN AFFINITY FOR THE METAL OF SAID MEMBERS AND (B) A QUANTITY OF SAID METAL WHICH SUBSTANTIALLY SATURATES SAID BATH, WHEREBY PARTICLES OF SAID MATERIAL ADHERE TO SAID MEMBERS; REMOVING SAID BODY, MEMBERS AND PARTICLES FROM SAID BATH AND COOLING THE ASSEMBLY SO THAT SAID PARTICLES ARE BONDED TO SAID MEMBERS; AND HEATING SAID ASSEMBLY TO THE ALLOYING TEMPERATURE OF THE MATERIALS THEREOF AND THEREAFTER COOLING SAID ASSEMBLY TO FORM ON SAID BODY A PLURALITY OF PN JUNCTIONS AND RECRYSTALLIZED SEMICONDUCTOR REGIONS OF THE OPPOSITE CONDUCTIVITY TYPE.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1969-09-12 | 1970-03-14 | 1970-09-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1973-09-12 | 1974-03-14 | 1974-09-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1977-09-12 | 1978-03-14 | 1978-09-13 | $7700.00 | Window Closed / Lapsed |