US3378735A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device housing with spring contact means and improved thermal characteristics
Assignee: Siemens AG
•
Filing: 1964-06-09
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Granted: 1968-04-16
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Expires: 1984-06-09
Abstract
No abstract record available.
Inventors
- 👤 Emeis Reimer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 06:45
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/138; H10W72/00
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
US3280383A
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US3280384A
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US3280387A
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US3299328A
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US3192454A
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US3293509A
Cited
US3293510A
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US3252060A
Cited
US3170098A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1971-04-16 | 1971-10-16 | 1972-04-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1975-04-16 | 1975-10-16 | 1976-04-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1979-04-16 | 1979-10-16 | 1980-04-16 | $7700.00 | Window Closed / Lapsed |