Encapsuled semiconductor with alloy-bonded carrier plates and pressure maintained connectors

Claim 1

A SEMICONDUCTOR DEVICE, COMPRISING A SEMICONDUCTOR MEMBER INCLUDING AN ESSENTIALLY MONOCRYSTALLINE PLATE OF SEMICONDUCTOR MATERIAL HAVING SPACED OPPOSITE SUBSTANTIALLY PARALLEL SURFACES, A CONTACT ELECTRODE ALLOYED TO EACH OF THE SUBSTANTIALLY PARALLEL SURFACES OF SAID SEMICONDUCTOR PLATE, A FIRST CARRIER PLATE ALLOY-BONDED TO ONE OF SAID CONTACT ELECTRODES AT ONE OF THE SURFACES OF SAID SEMICONDUCTOR PLATE AND A SECOND CARRIER PLATE ALLOY-BONDED TO THE OTHER OF SAID CONTACT ELECTRODES AT THE OPPOSITE OF THE SURFACES OF SAID SEMICONDUCTOR PLATE, EACH OF SAID FIRST AND SECOND CARRIER PLATES BEING SUBSTANTIALLY OF A METAL HAVING A THERMAL COEFFICIENT OF EXPANSION SIMILAR TO THAT OF SAID SEMICONDUCTOR MATERIAL; A HOUSING INCLUDING A COOLING BODY OF HEAD CONDUCTING MATERIAL IN HEAT CONDUCTIVE CONTACT WITH ONE OF SAID FIRST AND SECOND CARRIER PLATES; ELECTRICAL CONDUCTING MEANS IN SAID HOUSING IN ELECTRICALLY CONDUCTIVE CONTACT WITH THE OTHER OF SAID FIRST AND SECOND CARRIER PLATES; AND HOLDER MEANS INCLUDING PRESSURE EXERTING MEANS AFFIXED TO SAID COOLING BODY IN SAID HOUSING AND COVERING SAID SEMICONDUCTOR MEMBER FOR MAINTAINING CONTACT PRESSURE BETWEEN SAID SEMICONDUCTOR MEMBER AND SAID COOLING BODY.