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US3357099A Expired / Lapsed US ⏱️ 0.0 years remaining

Providing plated through-hole connections with the plating resist extending to the hole edges

Assignee: North American Aviation Corp
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Filing: 1962-10-29
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Granted: 1967-12-12
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Expires: 1982-10-29
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Abstract

No abstract record available.

Inventors

  • 👤 Richard A Nagy
  • 👤 Joe C Mericle

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-26 16:51
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/42; H05K3/423; H05K3/425; H05K3/427; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09545; H05K2203/00; H05K2203/14; H05K2203/1415; H05K3/02; H05K3/06; H05K3/061; H05K3/062; H05K3/10; H05K3/108; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165; Y10T29/4981; Y10T29/49812

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 136 words
A PROCESS FOR MANUFACTURING AN ELECTRICAL PATTERN ON A SUBSTRATE COMPRISING DRILLING HOLES THROUGH A METAL CLAD INSULATIVE SUBSTRATE ACCORDING TO A SELECTED PATTERN, RESIST PRINTING A CIRCUIT PATTERN ON SAID METAL CLADDING, SAID CIRCUIT PATTERN DEFINING THE CIRCUIT LINES TO BE PLATED AND BEING DEFINED BY SAID RESIST PRINTING EXTENDING TO THE OUTER EDGES OF SAID DRILLED HOLES, ELECTROLESS DEPOSITION OF A METAL FILM ON THE INNER CIRCUMFERENCE OF SAID HOLES, FIRST ELECTROPLATING WITH A LOW THROWING POWER SOLUTION SAID CIRCUIT LINES TO BE PLATED, SAID INNER CIRCUMFERENCE OF SAID HOLES HAVING AN ELECTRODEPOSITED METAL FILM ON THE INNER CIRCUMFERENCES THEREOF, AND THE EDGES OF SAID HOLES TO BE PLATED, THEREBY FORMING CONCENTRIC TERMINAL AREAS ELECTRICALLY CONNECTING SAID PLATED LINES AND SAID PLATED HOLE INNER CIRCUMFERENCES, SECOND ELECTROPLATING ON TOP OF SAID FIRST ELECTROPLATING, AND
Claim 2
Dependent Claim 136 words
A PROCESS FOR MANUFACTURING AN ELECTRICAL PATTERN ON A SUBSTRATE COMPRISING DRILLING HOLES THROUGH A METAL CLAD INSULATIVE SUBSTRATE ACCORDING TO A SELECTED PATTERN, RESIST PRINTING A CIRCUIT PATTERN ON SAID METAL CLADDING, SAID CIRCUIT PATTERN DEFINING THE CIRCUIT LINES TO BE PLATED AND BEING DEFINED BY SAID RESIST PRINTING EXTENDING TO THE OUTER EDGES OF SAID DRILLED HOLES, ELECTROLESS DEPOSITION OF A METAL FILM ON THE INNER CIRCUMFERENCE OF SAID HOLES, FIRST ELECTROPLATING WITH A LOW THROWING POWER SOLUTION SAID CIRCUIT LINES TO BE PLATED, SAID INNER CIRCUMFERENCE OF SAID HOLES HAVING AN ELECTRODEPOSITED METAL FILM ON THE INNER CIRCUMFERENCES THEREOF, AND THE EDGES OF SAID HOLES TO BE PLATED, THEREBY FORMING CONCENTRIC TERMINAL AREAS ELECTRICALLY CONNECTING SAID PLATED LINES AND SAID PLATED HOLE INNER CIRCUMFERENCES, SECOND ELECTROPLATING ON TOP OF SAID FIRST ELECTROPLATING, AND

References Cited (Backward Citations)

US2897409A Cited
US2872391A Cited
US3052957A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1970-12-11 1971-06-12 1971-12-12 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1974-12-11 1975-06-12 1975-12-12 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1978-12-11 1979-06-12 1979-12-12 $7700.00 Window Closed / Lapsed

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