Mounting assembly supporting semiconductor devices

Claim 1

A MOUNTING ASSEMBLY IN COMBINATION WITH SEMICONDUCTOR DEVICES MOUNTED THEREON, SAID SEMICONDUCTOR DEVICES EACH BEING COMPRISED OF A FLAT SUBSTANTIALLY THIN HOUSING HAVING AT LEAST THREE THIN FRAGILE METALLIC LEADS EXTENDING OUTWARDLY FROM SAID HOUSING IN SUBSTANTIALLY RADIAL FASHION; SAID MOUNTING ASSEMBLY BEING COMPRISED OF A FIRST ELONGATED STRIPS OF PLIABLE MATERIAL HAVING A PRESSURESENSITIVE ADHESIVE COATING ON ONE SURFACE THEREOF; FIRST MEANS BEING MOUNTED TO SAID PLIABLE MATERIAL ALLOWING AT LEAST PORTIONS OF THE ADHESIVE MATERIAL TO BE EXPOSED; THE WIDTH (W) OF SAID EXPOSED ADHESIVE SURFACE BEING SLIGHTLY GREATER THAN THE OUTER DIMENSIONS OF SAID HOUSINGS; THE WIDTH OF SAID FIRST MEANS BEING SUBSTANTIALLY GREATER THAN THE LARGEST OUTER DIMENSION OF SAID SEMICONDUCTOR DEVICES AS DEFINED BY THE OUTERMOST ENDS OF SAID METALLIC LEADS; SAID SEMICONDUCTOR DEVICES BEING MOUNTED AT SPACED INTERVALS ALONG SAID MOUNTING ASSEMBLY WITH THE HOUSING OF EACH SEMICONDUCTOR DEVICE BEING MOUNTED UPON AN EXPOSED ADHESIVE SURFACE REGION; EACH OF SAID SEMICONDUCTOR DEVICES BEING ANGULARLY ORIENTED RELATIVE TO SAID MOUNTING ASSEMBLY SO THAT THEIR METALLIC LEADS ARE PROTECTED BY SAID FIRST MEANS FROM SAID ADHESIVE SURFACE OVER SUBSTANTIALLY THEIR ENTIRE LENGTHS AND ARE FURTHER PROTECTED FROM BEING DEFORMED DURING ASSEMBLY, DISASSEMBLY AND HANDLING.