Method of fabricating thin film capacitors

Claim 1

A METHOD OF FABRICATING THIN FILM CAPACITORS COMPRISING THE STEPS OF: DEPOSITING A CONDUCTIVE MATERIAL ON A NON-CONDUCTIVE SUBSTRATE AS A FIRST AREA FILM; PROVIDING A LAYER OF DIELECTRIC MATERIAL OVER THE FIRST AREA FILM OF CONDUCTIVE MATERIAL; FORMING A SECOND AREA FILM OF CONDUCTIVE MATERIAL OVER THE LAYER OF DIELECTRIC MATERIAL; EXPOSING THE SURFACE OF THE SUBSTRATE ALONG AT LEAST A FIRST LINE BY SELECTIVELY REMOVING THE CONDUCTIVE FILMS AND DIELECTRIC LAYER THEREBY ISOLATING INDIVIDUAL DEVICES; MEASURING THE CAPACTIANCE OF THE RESULTING MULTI-LAYER DEVICES; AND ADJUSTING THE CAPACTIANCE OF EACH DEVICE TOWARD THE DESIRED VALUE BY INCREMENTALLY REMOVING THE SECOND CONDUCTIVE FILM FORM THE DIELECTRIC LAYER ALONG THE EDGES OF THE GROOVE FORMED DURING THE STEP OF EXPOSING THE SURFACE OF THE SUBSTRATE ALONG A LINE, THE REMOVAL OF THE SECOND CONDUCTIVE FILM REDUCING THE AREA OF THE UPPER ELECTRODES OF THE DEVICES.

Claim 2

A METHOD OF FABRICATING THIN FILM CAPACITORS COMPRISING THE STEPS OF: DEPOSITING A CONDUCTIVE MATERIAL ON A NON-CONDUCTIVE SUBSTRATE AS A FIRST AREA FILM; PROVIDING A LAYER OF DIELECTRIC MATERIAL OVER THE FIRST AREA FILM OF CONDUCTIVE MATERIAL; FORMING A SECOND AREA FILM OF CONDUCTIVE MATERIAL OVER THE LAYER OF DIELECTRIC MATERIAL; EXPOSING THE SURFACE OF THE SUBSTRATE ALONG AT LEAST A FIRST LINE BY SELECTIVELY REMOVING THE CONDUCTIVE FILMS AND DIELECTRIC LAYER THEREBY ISOLATING INDIVIDUAL DEVICES; MEASURING THE CAPACTIANCE OF THE RESULTING MULTI-LAYER DEVICES; AND ADJUSTING THE CAPACTIANCE OF EACH DEVICE TOWARD THE DESIRED VALUE BY INCREMENTALLY REMOVING THE SECOND CONDUCTIVE FILM FORM THE DIELECTRIC LAYER ALONG THE EDGES OF THE GROOVE FORMED DURING THE STEP OF EXPOSING THE SURFACE OF THE SUBSTRATE ALONG A LINE, THE REMOVAL OF THE SECOND CONDUCTIVE FILM REDUCING THE AREA OF THE UPPER ELECTRODES OF THE DEVICES.