Metal surface of improved bonding quality

Claim 1

THE METHOD OF TREATING A SURFACE OF COPPER SHEET MATERIAL TO IMPROVE ITS BONDING QUALITY WHICH COMPRISES (A) EMPLOYING A CYANIDE-FREE ALKALINE COPPER ELECTROLYTIC BATH CONSISTING ESSENTIALLY OF AN AQUEOUS SOLUTION OF COPPER SULFATE AND A COMPLEXING AGENT SELECTED FROM THE GROUP CONSISTING OF ROCHELLE SALTS AND ALKALI METAL SALTS OF CITRIC ACID, LACTIC ACID, GLYCOLLIC ACID, SALICYLIC ACID, GLYCEROL, PYROPHOSPHORIC ACID AND TETRABORIC ACID; (B) ELECTROLYZING SAID BATH USING SAID SURFACE AS THE CATHODE AT A TEMPERATURE OF FROM ABOUT 50*F. TO ABOUT 180*F., A CATHODIC CURRENT DENSITY OF FROM ABOUT 10 TO ABOUT 150 AMPERES PER SQUARE FOOT AND A TREATMENT TIME OF FROM ABOUT 2 TO ABOUT 120 SECONDS, WHEREBY THERE IS FORMED ON SAID SURFACE A THIN ADHERENT MICRO-ROUGH LAYER OF SUBSTANTIALLY GREATER SURFACE AREA THAN THE ORIGINAL SURFACE; (C) RINSING SAID SURFACE AFTER REMOVAL FROM SAID BATH; (D) EXPOSING THE FRESHLY PREPARED MICRO-ROUGH SURFACE FROM STEP (C) TO A MEMBER OF THE GROUP CONSISTING OF SOLUTIONS OF COMPOUNDS WHICH FORM A SULFIDE, TELLURIDE OR SELENIDE WITH COPPER AND WEAKLY ACIDIC SOLUTIONS OF COMPOUNDS WHICH FORM A CHROMATE, MOLYBDATE, TUNGSTATE OR VANADATE WITH COPPER.

Claim 2

THE METHOD OF TREATING A SURFACE OF COPPER SHEET MATERIAL TO IMPROVE ITS BONDING QUALITY WHICH COMPRISES (A) EMPLOYING A CYANIDE-FREE ALKALINE COPPER ELECTROLYTIC BATH CONSISTING ESSENTIALLY OF AN AQUEOUS SOLUTION OF COPPER SULFATE AND A COMPLEXING AGENT SELECTED FROM THE GROUP CONSISTING OF ROCHELLE SALTS AND ALKALI METAL SALTS OF CITRIC ACID, LACTIC ACID, GLYCOLLIC ACID, SALICYLIC ACID, GLYCEROL, PYROPHOSPHORIC ACID AND TETRABORIC ACID; (B) ELECTROLYZING SAID BATH USING SAID SURFACE AS THE CATHODE AT A TEMPERATURE OF FROM ABOUT 50*F. TO ABOUT 180*F., A CATHODIC CURRENT DENSITY OF FROM ABOUT 10 TO ABOUT 150 AMPERES PER SQUARE FOOT AND A TREATMENT TIME OF FROM ABOUT 2 TO ABOUT 120 SECONDS, WHEREBY THERE IS FORMED ON SAID SURFACE A THIN ADHERENT MICRO-ROUGH LAYER OF SUBSTANTIALLY GREATER SURFACE AREA THAN THE ORIGINAL SURFACE; (C) RINSING SAID SURFACE AFTER REMOVAL FROM SAID BATH; (D) EXPOSING THE FRESHLY PREPARED MICRO-ROUGH SURFACE FROM STEP (C) TO A MEMBER OF THE GROUP CONSISTING OF SOLUTIONS OF COMPOUNDS WHICH FORM A SULFIDE, TELLURIDE OR SELENIDE WITH COPPER AND WEAKLY ACIDIC SOLUTIONS OF COMPOUNDS WHICH FORM A CHROMATE, MOLYBDATE, TUNGSTATE OR VANADATE WITH COPPER.