Patent US3307972A successfully refreshed from Google Patents.
US3307972A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electroless copper deposition
Assignee: AT&T Inc
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Filing: 1963-03-11
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Granted: 1967-03-07
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Expires: 1983-03-11
Abstract
No abstract record available.
Inventors
- 👤 Robert A Ehrhardt
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 22:57
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/38; C23C18/40; C23C18/405
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
50 words
A METHOD FOR ELECTROLESS PLATING WITH COPPER COMPRISING THE STEP OF CONTACTING A METAL SURFACE OR A SENSITIZED NONMETAL SURFACE WITH AN AQUEOUS PLATING SOLUTION CATALYZED BY SAID SURFACE AT A TEMPERATURE OF 30*C. TO 70*C. SAID SOLUTION HAVING A PH VALUE OF 11.0 TO 12.0 AND CONSISTING ESSENTIALLY OF:
Claim 2
Independent Claim
50 words
A METHOD FOR ELECTROLESS PLATING WITH COPPER COMPRISING THE STEP OF CONTACTING A METAL SURFACE OR A SENSITIZED NONMETAL SURFACE WITH AN AQUEOUS PLATING SOLUTION CATALYZED BY SAID SURFACE AT A TEMPERATURE OF 30*C. TO 70*C. SAID SOLUTION HAVING A PH VALUE OF 11.0 TO 12.0 AND CONSISTING ESSENTIALLY OF:
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1970-03-06 | 1970-09-05 | 1971-03-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1974-03-06 | 1974-09-05 | 1975-03-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1978-03-06 | 1978-09-05 | 1979-03-07 | $7700.00 | Window Closed / Lapsed |