Hall plate devices

Claim 2

THE MANUFACTURE OF A HALL PLATE DEVICE BY PROVIDING A PLATE OF SEMI-CONDUCTOR HALL EFFECT MATERIAL ON A SHEET OF MECHANICALLY PROTECTIVE INSULATING MATERIAL WITH AN AREA OF THE SHEET LEFT UNCOVERED BY THE PLATE AT ONE SIDE OF THE LATTER, SUBSEQUENTLY FORMING CURRENT INPUT OHMIC CONTACTS ON THE PLATE BY DEPOSITION OF CONDUCTIVE MATERIAL IN ELECTRICAL CONTACT WITH THE PLATE AT OPPOSITE ENDS THEREOF, SAID MATERIAL EXTENDING AS RESPECTIVE STRIPS FROM SAID OPPOSITE ENDS OF THE PLATE ON TO SAID UNCOVERED AREA OF THE SHEET, SIMILARLY DEPOSITING AS A FIRST OUTPUT VOLTAGE OHMIC CONTACT FOR SAID PLATE FURTHER CONDUCTIVE MATERIAL IN ELECTRICAL CONTACT WITH THE PLATE AT AN INTERMEDIATE POSITION ALONG ITS SAID SIDE AND EXTENDING AS A FURTHER STRIP ON TO SAID UNCOVERED AREA OF THE SHEET, APPLYING OVER SAID FURTHER STRIP A FILM OF INSULATING MATERIAL EXTENDING ACROSS THE PLATE WITH A SMALL AREA THEREOF LEFT EXPOSED AT ITS OPPOSITE SIDE, AND SIMILARLY DEPOSITING AS A SECOND VOLTAGE OUTPUT OHMIC CONTACT FOR THE PLATE OF CONDUCTIVE MATERIAL IN ELECTRICAL CONTACT WITH SAID SMALL AREA OF THE PLATE AND EXTENDING AS A STRIP OVER SAID FILM OF INSULATING MATERIAL AND ON TO SAID UNCOVERED AREA OF THE SHEET, ALL SAID CONDUCTIVE STRIPS BEING ELECTRICALLY ISOLATED FROM EACH OTHER AND EXTENDING ON TO SAID UNCOVERED AREA SUFFICIENT FOR EXTERNAL CONNECTION TO BE MADE TO THE STRIPS AT A POSITION REMOVED FROM THE HALL PLATE.

Claim 3

A HALL PLATE DEVICE COMPRISING A HALL PLATE OF SEMICONDUCTOR HALL EFFECT MATERIAL ON A SHEET OF MECHANICALLY PROTECTING INSULATING MATERIAL WITH AN AREA OF THE SHEET LEFT UNCOVERED BY THE PLATE AT ONE SIDE OF THE LATTER, CURRENT INPUT OHMIC CONTACTS FOR THE PLATE COMPRISING TWO DEPOSITED STRIPS OF CONDUCTIVE MATERIAL IN ELECTRICAL CONTACT WITH AND CONNECTED DIRECTLY TO THE PLATE AT OPPOSITE ENDS THEREOF, SAID STRIPS EXTENDING CONTINUOUSLY FROM THE POINT OF CONNECTION WITH THE PLATE TO SAID UNCOVERED AREA OF THE SHEET, A FIRST OUTPUT VOLTAGE OHMIC CONTACT CONSTITUTED BY A FURTHER STRIP OF DEPOSITED CONDUCTIVE MATERIAL IN ELECTRICAL CONTACT WITH AND CONNECTED DIRECTLY TO THE PLATE AT AN INTERMEDIATE POSITION ALONG ITS SAID SIDE AND EXTENDING CONTINUOUSLY FROM THE POINT OF CONNECTION WITH THE PLATE TO SAID UNCOVERED AREA OF THE SHEET, A FILM OF INSULATING MATERIAL OVERLYING SAID FURTHER STRIP AND EXTENDING ACROSS THE PLATE WITH A SMALL AREA OF THE PLATE LEFT EXPOSED AT ITS OPPOSITE SIDE, AND A SECOND OUTPUT VOLTAGE OHMIC CONTACT CONSTITUTED BY ANOTHER STRIP OF DEPOSITED CONDUCTIVE MATERIAL IN ELECTRICAL CONTACT WITH AND CONNECTED DIRECTLY TO SAID SMALL AREA OF THE PLATE SUPERIMPOSED ABOVE SAID FURTHER STRIP AND EXTENDING CONTINUOUSLY FROM THE POINT OF CONNECTION WITH THE PLATE OVER SAID FILM AND ON TO THE UNCOVERED AREA OF THE SHEET, ALL SAID STRIPS BEING ELECTRICALLY ISOLATED FROM EACH OTHER AND EXTENDING ON TO SAID UNCOVERED AREA SUFFICIENT FOR EXTERNAL CONNECTION TO BE MADE AT POSITIONS REMOVED FROM THE HALL PLATE.

Claim 4

A HALL PLATE DEVICE COMPRISING A HALL PLATE OF SEMICONDUCTOR HALL EFFECT MATERIAL ON A SHEET OF MECHANICALLY PROTECTING INSULATING MATERIAL WITH AN AREA OF THE SHEET LEFT UNCOVERED BY THE PLATE AT ONE SIDE OF THE LATTER, CURRENT INPUT OHMIC CONTACTS FOR THE PLATE COMPRISING TWO DEPOSITED STRIPS OF CONDUCTIVE MATERIAL IN ELECTRICAL CONTACT WITH AND CONNECTED DIRECTLY TO THE PLATE AT OPPOSITE ENDS THEREOF, SAID STRIPS EXTENDING CONTINUOUSLY FROM THE POINT OF CONNECTION WITH THE PLATE TO SAID UNCOVERED AREA OF THE SHEET, A FIRST OUTPUT VOLTAGE OHMIC CONTACT CONSTITUTED BY A FURTHER STRIP OF DEPOSITED CONDUCTIVE MATERIAL IN ELECTRICAL CONTACT WITH AND CONNECTED DIRECTLY TO THE PLATE AT AN INTERMEDIATE POSITION ALONG ITS SAID SIDE AND EXTENDING CONTINUOUSLY FROM THE POINT OF CONNECTION WITH THE PLATE TO SAID UNCOVERED AREA OF THE SHEET, A FILM OF INSULATING MATERIAL OVERLYING SAID FURTHER STRIP AND EXTENDING ACROSS THE PLATE WITH A SMALL AREA OF THE PLATE LEFT EXPOSED AT ITS OPPOSITE SIDE, AND A SECOND OUTPUT VOLTAGE OHMIC CONTACT CONSTITUTED BY ANOTHER STRIP OF DEPOSITED CONDUCTIVE MATERIAL IN ELECTRICAL CONTACT WITH AND CONNECTED DIRECTLY TO SAID SMALL AREA OF THE PLATE SUPERIMPOSED ABOVE SAID FURTHER STRIP AND EXTENDING CONTINUOUSLY FROM THE POINT OF CONNECTION WITH THE PLATE OVER SAID FILM AND ON TO THE UNCOVERED AREA OF THE SHEET, ALL SAID STRIPS BEING ELECTRICALLY ISOLATED FROM EACH OTHER AND EXTENDING ON TO SAID UNCOVERED AREA SUFFICIENT FOR EXTERNAL CONNECTION TO BE MADE AT POSITIONS REMOVED FROM THE HALL PLATE.