US3207838A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Substrates having solderable gold films formed thereon, and methods of making the same
Assignee: AT&T Inc
•
Filing: 1961-06-30
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Granted: 1965-09-21
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Expires: 1981-06-30
Abstract
No abstract record available.
Inventors
- 👤 Walter R Mccormack
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 10:56
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K1/097; C; C03; C03C; C03C17/00; C03C17/06; C03C17/10; H01; H01B; H01B1/00; H05K3/00; H05K3/10; H05K3/12; H05K3/1283; H05K3/1291; H05K2203/00; H05K2203/11; H05K2203/1126; H05K3/30; H05K3/32; H05K3/34; H05K3/341
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
114 words
THE METHOD OF FORMING A SOLDERABLE GOLD FILM ON A GLASS SUBSTRATE WITH A GOLD-CONTAINING COMPOSITION CAPABLE OF BEING DECOMPOSED BY HEAT INTO ELEMENTAL GOLD AND ORGANIC MATERIALS WHICH COMPOSITION IS SUITABLE FOR FORMING AN ADHERENT GOLD FILM TO THE SUBSTRATE BY FIRING TECHNIQUES, WHICH COMPRISES APPLYING TO THE GLASS SUBSTRATE THE GOLD-CONTAINING COMPOSITION, AND FIRING THE COMPOSITION AT A TEMPERATURE BETWEEN 150*F. AND 350*F. BELOW THE SOFTENING POINT OF SAID GLASS AND FOR A PERIOD OF FROM ONE-HALF HOUR TO THREE HOURS TO DECOMPOSE THE GOLD-CONTAINING COMPOSITION AND DRIVE OFF THE ORGANIC MATERIALS SO THAT SAID SOLDERABLE GOLD FILM IS FORMED ON THE SUBSTRATE WITHOUT SUBSTANTIAL DIFFUSION OF THE GOLD INTO THE SUBSTRATE.
Claim 2
Independent Claim
114 words
THE METHOD OF FORMING A SOLDERABLE GOLD FILM ON A GLASS SUBSTRATE WITH A GOLD-CONTAINING COMPOSITION CAPABLE OF BEING DECOMPOSED BY HEAT INTO ELEMENTAL GOLD AND ORGANIC MATERIALS WHICH COMPOSITION IS SUITABLE FOR FORMING AN ADHERENT GOLD FILM TO THE SUBSTRATE BY FIRING TECHNIQUES, WHICH COMPRISES APPLYING TO THE GLASS SUBSTRATE THE GOLD-CONTAINING COMPOSITION, AND FIRING THE COMPOSITION AT A TEMPERATURE BETWEEN 150*F. AND 350*F. BELOW THE SOFTENING POINT OF SAID GLASS AND FOR A PERIOD OF FROM ONE-HALF HOUR TO THREE HOURS TO DECOMPOSE THE GOLD-CONTAINING COMPOSITION AND DRIVE OFF THE ORGANIC MATERIALS SO THAT SAID SOLDERABLE GOLD FILM IS FORMED ON THE SUBSTRATE WITHOUT SUBSTANTIAL DIFFUSION OF THE GOLD INTO THE SUBSTRATE.
Claim 3
Dependent Claim
89 words
A PRINTED CIRCUIT BOARD WHICH COMPRISES A GLASS SUBSTRATE, AN ELECTRICALLY CONDUCTIVE, SOLDERABLE GOLD FILM FORMED ON SAID SUBSTRATE BY APPLYING A GOLD-CONTAINING COMPOSITION ONTO SAID SUBSTRATE WHICH COMPOSITION IS CAPABLE OF BEING DECOMPOSED INTO ELEMENTAL GOLD AND ORGANIC MATERIALS BY FIRING TECHNIQUES TO FORM AN ADHERENT GOLD FILM ON THE SUBSTRATE AND FIRING THE COMPOSITION AT A TEMPERATURE BETWEEN 150*F. AND 350*F. BELOW THE SOFTENING POINT OF SAID GLASS FOR A PERIOD OF FROM ONE-HALF HOUR TO THREE HOURS, AND A LEAD SOLDERED TO SAID SOLDERABLE GOLD FILM.
Claim 4
Dependent Claim
89 words
A PRINTED CIRCUIT BOARD WHICH COMPRISES A GLASS SUBSTRATE, AN ELECTRICALLY CONDUCTIVE, SOLDERABLE GOLD FILM FORMED ON SAID SUBSTRATE BY APPLYING A GOLD-CONTAINING COMPOSITION ONTO SAID SUBSTRATE WHICH COMPOSITION IS CAPABLE OF BEING DECOMPOSED INTO ELEMENTAL GOLD AND ORGANIC MATERIALS BY FIRING TECHNIQUES TO FORM AN ADHERENT GOLD FILM ON THE SUBSTRATE AND FIRING THE COMPOSITION AT A TEMPERATURE BETWEEN 150*F. AND 350*F. BELOW THE SOFTENING POINT OF SAID GLASS FOR A PERIOD OF FROM ONE-HALF HOUR TO THREE HOURS, AND A LEAD SOLDERED TO SAID SOLDERABLE GOLD FILM.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1968-09-20 | 1969-03-22 | 1969-09-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1972-09-20 | 1973-03-22 | 1973-09-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1976-09-20 | 1977-03-22 | 1977-09-21 | $7700.00 | Window Closed / Lapsed |