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US3293092A Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor device fabrication

Assignee: International Business Machines Corp
•
Filing: 1964-03-17
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Granted: 1966-12-20
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Expires: 1984-03-17
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Abstract

No abstract record available.

Inventors

  • 👤 John B Gunn

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-23 11:22
CPC Classifications
H; H10; H10P; H10P50/00; H10P50/69; H10P50/691; H10P50/692; H10D; H10D99/00; H10P50/60; H10P50/64; H10P50/642; H10P50/646

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 135 words
A METHOD OF MAKING SEMICONDUCTOR DEVICES INCLUDING THE FABRICATION OF A SEMICONDUCTOR JUNCTION OF SMALL AREA COMPRISING, DEPOSITING AT LEAST ONE THIN LAYER OF FIRST SEMICONDUCTOR MATERIAL HAVING A FIRST BAND GAP UPON A SUBSTRATE OF SECOND SEMICONDUCTOR MATERIAL HAVING A SECOND BAND GAP TO FORM A JUNCTION THEREBETWEEN, APPLYING A DOT OF ETCH-RESISTANT MATERIAL TO COVER A PORTION OF SAID ONE THIN LAYER, ETCHING THE ENTIRE STRUCTURE THUS FORMED WITH AN ETCHANT EFFECTIVE TO DISSOLVE SUBSTANTIALLY ONLY SAID FIRST SEMICONDUCTOR MATERIAL SUCH AS TO REMOVE ALL OF SAID ONE THIN LAYER FROM SAID SUBSTRATE EXCEPT FOR THAT PORTION UNDERLYING SAID DOT OF ETCH-RESISTANT MATERIAL, AND CONTINUING SAID LAST-MENTIONED STEP TO PURPOSEFULLY DISSOLVE SAID UNDERLYING PORTION OF SAID ONE THIN LAYER EXCEPT FOR A SMALL PART THEREOF DEFINING SAID SMALL AREA JUNCTION WITH SAID SUBSTRATE.
Claim 2
Independent Claim 135 words
A METHOD OF MAKING SEMICONDUCTOR DEVICES INCLUDING THE FABRICATION OF A SEMICONDUCTOR JUNCTION OF SMALL AREA COMPRISING, DEPOSITING AT LEAST ONE THIN LAYER OF FIRST SEMICONDUCTOR MATERIAL HAVING A FIRST BAND GAP UPON A SUBSTRATE OF SECOND SEMICONDUCTOR MATERIAL HAVING A SECOND BAND GAP TO FORM A JUNCTION THEREBETWEEN, APPLYING A DOT OF ETCH-RESISTANT MATERIAL TO COVER A PORTION OF SAID ONE THIN LAYER, ETCHING THE ENTIRE STRUCTURE THUS FORMED WITH AN ETCHANT EFFECTIVE TO DISSOLVE SUBSTANTIALLY ONLY SAID FIRST SEMICONDUCTOR MATERIAL SUCH AS TO REMOVE ALL OF SAID ONE THIN LAYER FROM SAID SUBSTRATE EXCEPT FOR THAT PORTION UNDERLYING SAID DOT OF ETCH-RESISTANT MATERIAL, AND CONTINUING SAID LAST-MENTIONED STEP TO PURPOSEFULLY DISSOLVE SAID UNDERLYING PORTION OF SAID ONE THIN LAYER EXCEPT FOR A SMALL PART THEREOF DEFINING SAID SMALL AREA JUNCTION WITH SAID SUBSTRATE.

References Cited (Backward Citations)

US2731333A Cited
US2878147A Cited
US2846340A Cited
US2871110A Cited
US3110849A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1969-12-19 1970-06-20 1970-12-20 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1973-12-19 1974-06-20 1974-12-20 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1977-12-19 1978-06-20 1978-12-20 $7700.00 Window Closed / Lapsed

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