Patent US3288639A successfully refreshed from Google Patents.
US3288639A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for making a plural layered printed circuit board
Assignee: Xerox Corp
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Filing: 1964-12-04
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Granted: 1966-11-29
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Expires: 1984-12-04
Abstract
No abstract record available.
Inventors
- 👤 Frederick Henry Smith Jr
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 14:57
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/16; H05K1/167; H01; H01B; H01B1/00; H10; H10N; H10N97/00; H05K2201/00; H05K2201/03; H05K2201/032; H05K2201/0326; H05K2201/0332; H05K2201/0335; H05K2201/0344; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0165; H05K2203/03; H05K2203/0315; H05K2203/11; H05K2203/1105; H05K2203/12; H05K2203/121; H05K2203/15; H05K2203/1536; H05K3/00; H05K3/10; H05K3/105; H05K3/18; H05K3/181
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
118 words
THE METHOD OF MAKING A LAMINATED PLATE FOR USE IN FORMING PRINTED CIRCUITS COMPRISING THE SEQUENTIAL STEPS OF: (A) IMMERSING A DIELECTRIC BASE PLATE FOR A PREDETERMINED TIME PERIOD OF APPROXIMATELY FIVE TO TEN SECONDS IN A SOLUTION OF TIN ALCOHOLATE WHICH DEPOSITS THEREON; (B) HEATING THE DEPOSIT ON SAID PLATE TO APPROXIMATELY 60*C. IN THE PRESENCE OF OXYGEN SO AS TO FORM AN ELECTRICALLY RESISTIVE LAYER OF TIN OXIDE THEREON; (C) SENSITIZING AND SEEDING THE TIN OXIDE SURFACE OF SAID PLATE; AND (D) IMMERSING SAID PLATE IN ANOTHER SOLUTION FOR A PREDETERMINED TIME PERIOD TO CHEMICALLY AND ELECTROLESSLY DEPOSIT AN ELECTRICALLY CONDUCTIVE LAYER SELECTED FROM THE GROUP CONSISTING OF COPPER AND NICKEL OVERLYING SAID TIN OXIDE LAYER.
Claim 2
Independent Claim
118 words
THE METHOD OF MAKING A LAMINATED PLATE FOR USE IN FORMING PRINTED CIRCUITS COMPRISING THE SEQUENTIAL STEPS OF: (A) IMMERSING A DIELECTRIC BASE PLATE FOR A PREDETERMINED TIME PERIOD OF APPROXIMATELY FIVE TO TEN SECONDS IN A SOLUTION OF TIN ALCOHOLATE WHICH DEPOSITS THEREON; (B) HEATING THE DEPOSIT ON SAID PLATE TO APPROXIMATELY 60*C. IN THE PRESENCE OF OXYGEN SO AS TO FORM AN ELECTRICALLY RESISTIVE LAYER OF TIN OXIDE THEREON; (C) SENSITIZING AND SEEDING THE TIN OXIDE SURFACE OF SAID PLATE; AND (D) IMMERSING SAID PLATE IN ANOTHER SOLUTION FOR A PREDETERMINED TIME PERIOD TO CHEMICALLY AND ELECTROLESSLY DEPOSIT AN ELECTRICALLY CONDUCTIVE LAYER SELECTED FROM THE GROUP CONSISTING OF COPPER AND NICKEL OVERLYING SAID TIN OXIDE LAYER.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1969-11-28 | 1970-05-30 | 1970-11-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1973-11-28 | 1974-05-30 | 1974-11-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1977-11-28 | 1978-05-30 | 1978-11-29 | $7700.00 | Window Closed / Lapsed |