US3288639A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for making a plural layered printed circuit board
Assignee: Xerox Corp
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Filing: 1964-12-04
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Granted: 1966-11-29
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Expires: 1984-12-04
Abstract
No abstract record available.
Inventors
- 👤 Frederick Henry Smith Jr
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 10:56
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/16; H05K1/167; H01; H01B; H01B1/00; H10; H10N; H10N97/00; H05K2201/00; H05K2201/03; H05K2201/032; H05K2201/0326; H05K2201/0332; H05K2201/0335; H05K2201/0344; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0165; H05K2203/03; H05K2203/0315; H05K2203/11; H05K2203/1105; H05K2203/12; H05K2203/121; H05K2203/15; H05K2203/1536; H05K3/00; H05K3/10; H05K3/105; H05K3/18; H05K3/181
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
118 words
THE METHOD OF MAKING A LAMINATED PLATE FOR USE IN FORMING PRINTED CIRCUITS COMPRISING THE SEQUENTIAL STEPS OF: (A) IMMERSING A DIELECTRIC BASE PLATE FOR A PREDETERMINED TIME PERIOD OF APPROXIMATELY FIVE TO TEN SECONDS IN A SOLUTION OF TIN ALCOHOLATE WHICH DEPOSITS THEREON; (B) HEATING THE DEPOSIT ON SAID PLATE TO APPROXIMATELY 60*C. IN THE PRESENCE OF OXYGEN SO AS TO FORM AN ELECTRICALLY RESISTIVE LAYER OF TIN OXIDE THEREON; (C) SENSITIZING AND SEEDING THE TIN OXIDE SURFACE OF SAID PLATE; AND (D) IMMERSING SAID PLATE IN ANOTHER SOLUTION FOR A PREDETERMINED TIME PERIOD TO CHEMICALLY AND ELECTROLESSLY DEPOSIT AN ELECTRICALLY CONDUCTIVE LAYER SELECTED FROM THE GROUP CONSISTING OF COPPER AND NICKEL OVERLYING SAID TIN OXIDE LAYER.
Claim 2
Independent Claim
118 words
THE METHOD OF MAKING A LAMINATED PLATE FOR USE IN FORMING PRINTED CIRCUITS COMPRISING THE SEQUENTIAL STEPS OF: (A) IMMERSING A DIELECTRIC BASE PLATE FOR A PREDETERMINED TIME PERIOD OF APPROXIMATELY FIVE TO TEN SECONDS IN A SOLUTION OF TIN ALCOHOLATE WHICH DEPOSITS THEREON; (B) HEATING THE DEPOSIT ON SAID PLATE TO APPROXIMATELY 60*C. IN THE PRESENCE OF OXYGEN SO AS TO FORM AN ELECTRICALLY RESISTIVE LAYER OF TIN OXIDE THEREON; (C) SENSITIZING AND SEEDING THE TIN OXIDE SURFACE OF SAID PLATE; AND (D) IMMERSING SAID PLATE IN ANOTHER SOLUTION FOR A PREDETERMINED TIME PERIOD TO CHEMICALLY AND ELECTROLESSLY DEPOSIT AN ELECTRICALLY CONDUCTIVE LAYER SELECTED FROM THE GROUP CONSISTING OF COPPER AND NICKEL OVERLYING SAID TIN OXIDE LAYER.
References Cited (Backward Citations)
US2567331A
Cited
US2702253A
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US2805965A
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US2796364A
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US2829059A
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US2971867A
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US3105772A
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US3169892A
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US3011920A
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US3162512A
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US3200326A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1969-11-28 | 1970-05-30 | 1970-11-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1973-11-28 | 1974-05-30 | 1974-11-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1977-11-28 | 1978-05-30 | 1978-11-29 | $7700.00 | Window Closed / Lapsed |