Freely expanding pressure mounted semiconductor device

Claim 1

A SEMICONDUCTOR DEVICE COMPRISING A SEMICONDUCTOR MEMBER HAVING A BODY OF MONOCRYSTALLINE SEMICONDUCTOR MATERIAL WITH A P-N JUNCTION AND INTEGRALLY JOINED ELECTRODES ON RESPECTIVE OPPOSITE SIDES AND HAVING TWO REINFORCING BODIES ALLOY-BONDED TO SAID RESPECTIVE ELECTRODES IN FACE-TO-FACE RELATION THERETO, SAID REINFORCING BODIES CONSISTING OF METAL HAVING A THERMAL COEFFICIENT OF EXPANSION APPROXIMATELY EQUAL TO THAT OF SAID SEMICONDUCTOR MATERIAL; A HOUSING HAVING AN INSULATING RING SPACED FROM AND SURROUNDING SAID SEMICONDUCTOR MEMBER AND HAVING RESILIENT TOP AND BOTTOM COVER PLATES OF METAL WHOSE RESPECTIVE RIM PORTIONS ARE JOINED AND SEALED TO SAID RING ON OPPOSITE SIDES THEREOF; SAID SEMICONDUCTOR MEMBER BEING INSERTED BETWEEN SAID TWO COVER PLATES IN FACT-TO-FACE CONTINUOUS RELATION THERETO AND CAPABLE OF LATERAL GLIDING MOTION RELATIVE THERETO WHEN SAID COVER PLATES ARE UNSTRESSED, AND SAID PLATES HAVING STOP MEANS FOR LIMITING LATERAL DISPLACEMENT OF SAID SEMICONDUCTOR MEMBER.