Optical soldering technique and apparatus

Claim 1

A METHOD FOR MAKING A SOLDERED CONNECTION BETWEEN AN ELECTRICAL LEAD AND A PRINTED CIRCUIT BOARD, SAID BOARD HAVING A BORE THERETHROUGH IN THE REGION OF SAID CONNECTION THROUGH WHICH SAID LEAD PROJECTS, COMPRISING THE STEPS OF: MOUNTING THE CIRCUIT BOARD IN A JIG WITH SAID LEAD PROJECTING UPWARDLY THROUGH SAID BORE; PLACING AN ANNULAR BODY OF SOLDER ON SAID UPWARDLY PROJECTING LEAD AND IN ENGAGEMENT WITH THE UPPER SURFACE IN SAID CIRCUIT BOARD; FOCUSING A HIGH INTENSITY, CONCENTRATED BEAM OF RADIANT ENERGY ON SAID REGION FOR A LENGTH OF TIME SUFFICIENT TO EFFECT MELTING OF SAID ANNULAR BODY OF SOLDER AND MAKING OF SAID CONNECTION, AND, BEFORE FOCUSING SAID HIGH INTENSITY BEAM ON SAID REGION, REDUCING THE INTENSITY OF SAID CONCENTRATED BEAM OF VISIBLE RADIANT ENERGY ON SAID CIRCUIT BOARD; AND MOVING SAID CIRCUIT BOARD TO POSITION SAID REDUCED INTENSITY BEAM ON SAID REGION.