Apparatus providing compact semiconductor unit

Claim 1

A SEMICONDUCTOR PACKAGE COMPRISING: (A) AT LEAST TWO SEMICONDUCTORS, EACH HAVING AT LEAST TWO COOPERATING SEMICONDUCTIVE ELEMENTS; (B) A RELATIVELY FLAT SOLID SUPPORT DISC HAVING A PLURALITY OF SEPARATE SPACED APART OPENINGS THEREIN EXTENDING BETWEEN OPPOSITE SIDES THEREOF AND A NARROW BEVELED SURFACE AROUND ONE SIDE OF SAID SUPPORT DISC; (C) A PLURALITY OF ELECTRICALLY CONDUCTIVE RODS EXTENDING THROUGH SAID SUPPORT DISC, ONE ELEMENT OF EACH OF SAID SEMICONDUCTORS BEING DIRECTLY PHYSICALLY AND ELECTRICALLY CONNECTED ON SAID ONE SIDE OF SAID SUPPORT DISC TO A DIFFERENT ONE OF SAID RODS, AND THE OTHER ELEMENT OF EACH OF SAID SEMICONDUCTORS BEING ELECTRICALLY CONNECTED TO STILL DIFFERENT ONES OF SAID RODS; (D) INSULATING COLLARS FIXED WITHIN EACH OF SAID OPENINGS IN SAID SUPPORT DISC WITH EACH OF RODS PASSING THROUGH AND BEING FIXED IN A DIFFERENT ONE OF SAID INSULATING COLLARS WHEREBY SAID RODS ARE ELECTRICALLY INSULATED FROM ONE ANOTHER; AND (E) A CYLINDRICAL CAP MEMBER HAVING A BEVELED SURFACE AROUND THE INNER EDGE OF THE OPEN END THEREOF AND SECURED TO SAID SUPPORT DISC TO ENCLOSE SAID SEMICONDUCTORS AND SAID RODS ON SAID ONE SIDE OF SAID SUPPORT DISC; (F) SAID SUPPORT DISC AND SAID CAP MEMBER HAVING THEIR RESPECTIVE BEVELED SURFACES IN SEATING AND SEALING ENGAGEMENT ACROSS THE ENTIRE INTERFACE THEREBETWEEN.