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US3256374A
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US
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Method of molding finely divided particles by resin
Assignee: NIPPON EKIKA SEIKEI KABUSHIKI
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Filing: 1962-12-26
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Granted: 1966-06-14
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Expires: 1982-12-26
Abstract
No abstract record available.
Inventors
- 👤 Suzuki Shigemasa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 12:17
CPC Classifications
C; C08; C08J; C08J5/00
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
195 words
METHOD OF MOLDING COMPRISES MIXING UNIFORMLY 100 PARTS BY WEIGHT OF A THERMOPLASTIC RESIN, MORE THAN 150 PARTS BUT LESS THAN 500 PARTS BY WEIGHT OF AN ORGANIC SOLVENT AND MORE THAN 150 PARTS BUT LESS THAN 500 PARTS BY WEIGHT OF FINELY DIVIDED PARTICLES FINER THAN 150 MESH, THE SAID ORGANIC SOLVENT BEING EVAPORABLE AT A TEMPERATURE NEAR THE MELTING POINT OF THE SAID RESIN AND AT LEAST CAPABLE OF SWELLING SAID RESIN AT A TEMPERATURE NEARLY 50*C. BELOW THE MELTING POINT OF THE SAID RESIN, THE SAID PARTICLES BEING THERMALLY STABLE AT A TEMPERTURE NEAR THE MELTING POINT OF SAID RESIN, BEING INSOLUBLE IN THE SAID SOLVENT AND HAVING A HYGROSCOPIC AND ADSORPTIVE PROPERTY; MOLDING THE SO OBTAINED MIXTURE INTO A SOFT MOLDING CONTAINING THE SAID RESIN, ORGANIC SOLVENT AND PARTICLES; AND THEREAFTER HEATING THE SAID MOLDING GRADUALLY UP TO A TEMPERATURE NEAR THE MELTING POINT OF THE MIXTURE SO AS TO EVAPORATE THE ORGANIC SOLVENT, WHEREBY THE INTERIOR OF THE MOLDING IS COMPOSED OF THE PARTICLES IN THE RESIN WHICH BINDS THE SAID PARTICLES, AND WHEREIN THE SURFACE THEREOF IS COMPOSED OF ONLY THE SAID PARTICLES AND A VOID BETWEEN THE PARTICLES.
Claim 2
Dependent Claim
195 words
METHOD OF MOLDING COMPRISES MIXING UNIFORMLY 100 PARTS BY WEIGHT OF A THERMOPLASTIC RESIN, MORE THAN 150 PARTS BUT LESS THAN 500 PARTS BY WEIGHT OF AN ORGANIC SOLVENT AND MORE THAN 150 PARTS BUT LESS THAN 500 PARTS BY WEIGHT OF FINELY DIVIDED PARTICLES FINER THAN 150 MESH, THE SAID ORGANIC SOLVENT BEING EVAPORABLE AT A TEMPERATURE NEAR THE MELTING POINT OF THE SAID RESIN AND AT LEAST CAPABLE OF SWELLING SAID RESIN AT A TEMPERATURE NEARLY 50*C. BELOW THE MELTING POINT OF THE SAID RESIN, THE SAID PARTICLES BEING THERMALLY STABLE AT A TEMPERTURE NEAR THE MELTING POINT OF SAID RESIN, BEING INSOLUBLE IN THE SAID SOLVENT AND HAVING A HYGROSCOPIC AND ADSORPTIVE PROPERTY; MOLDING THE SO OBTAINED MIXTURE INTO A SOFT MOLDING CONTAINING THE SAID RESIN, ORGANIC SOLVENT AND PARTICLES; AND THEREAFTER HEATING THE SAID MOLDING GRADUALLY UP TO A TEMPERATURE NEAR THE MELTING POINT OF THE MIXTURE SO AS TO EVAPORATE THE ORGANIC SOLVENT, WHEREBY THE INTERIOR OF THE MOLDING IS COMPOSED OF THE PARTICLES IN THE RESIN WHICH BINDS THE SAID PARTICLES, AND WHEREIN THE SURFACE THEREOF IS COMPOSED OF ONLY THE SAID PARTICLES AND A VOID BETWEEN THE PARTICLES.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1969-06-13 | 1969-12-13 | 1970-06-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1973-06-13 | 1973-12-13 | 1974-06-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1977-06-13 | 1977-12-13 | 1978-06-14 | $7700.00 | Window Closed / Lapsed |