D. c. power distribution arrangement for high frequency applications

Claim 1

A D.C. POWER DISTRIBUTION SYSTEM FOR SUPPLYING D.C. POWER TO A PLURALITY OF HIGH FREQUENCY CIRCUIT COMPONENTS IN MODULAR FORM AND WHICH ESTABLISHES AN EFFECTIVE A.C. GROUND FOR THE MODULES, SAID SYSTEM INCLUDING A PLURALITY OF D.C. PATHS COMPRISING: (A) A METAL GROUND PLATE OF EXTENDED AREA, (B) A THIN DIELECTRIC LAYER OVERLAYING SAID GROUND PLATE, (C) SAID GROUND PLATE AND DIELECTRIC LAYER HAVING A FIRST SERIES OF SUPER POSED APERTURES OF GIVEN DIMENSION DISPOSED THEREIN WHCH ARE ADAPTED FOR INSERTION OF SAID MODULES, (D) A PLURALITY OF METAL STRIPS ELECTRICALLY INSULATED FROM EACH OTHER OVERLAYING SAID DIELECTRIC LAYER, THE RATIO OF THE SPACING BETWEEN SAID GROUND PLATE AND SAID STRIPS AND THE AVERAGE WIDTH OF SAID STRIPS BEING LESS THAN .01, SAID PATHS THEREBY BEING CHARACTERIZED BY A LOW CHARACTERISTIC IMPEDANCE AND LOW Q FOR HIGH FREQUENCY ENERGY, (E) SAID METAL STRIPS HAVING A SECOND SERIES OF APERTURES CONCENTRICALLY ARRANGED WITH RESPECT TO SAID FIRST SERIES AND A SMALLER DIMENSION THAN SAID GIVEN DIMENSION SO AS TO PROVIDE EXPOSED SURFACES ON SAID METAL STRIPS FOR MAJING ELECTRICAL CONTACT WITH CORRESPONDING CONDUCTIVE SURFACES OF SAID MODULES UPON INSERTION THEREOF.