Patent US3247577A successfully refreshed from Google Patents.
US3247577A
Expired / Lapsed
US
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Thermoelectric module assembly technique
Assignee: Borg Warner Corp
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Filing: 1962-12-28
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Granted: 1966-04-26
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Expires: 1982-12-28
Abstract
No abstract record available.
Inventors
- 👤 Boubene M Jaremus
- 👤 Nieter Temple
- 👤 Charles E Rufer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 23:44
CPC Classifications
F; F25; F25B; F25B21/00; F25B21/02; H; H10; H10N; H10N10/00; H10N10/01; H10N10/80; H10N10/81; H10N10/817; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49147
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
164 words
THE METHOD OF MAKING A HEAT PUMP ASEMBLY OF COMPONENTS COMPRISING A THERMOELECTRIC MODULE HAVING HOT AND COLD JUNCTIONS DEFINED BY BUS BARS, FIRST AND SECOND ALUMINUM OXIDE WAFERS, AND FIRST AND SECOND BASE PLATES, COMPRISING THE STEPS OF: APPLYING CONDUCTIVE SILVER PASTE, TO ONE SIDE OF EACH WAFER IN PATTERNS WHICH MATCH THE BUS BAR PATTERNS, AND SUBSTANTIALLY ENTIRELY ACROSS THE OTHER SIDE OF EACH WAFER; APPLYING HEAT TO CURE THE SILVER PASTE; COPPER PLATING SUBSTANTIALLY AN ENTIRE FACE OF EACH BASE PLATE; TINNING WITH SOLDER THE FACES OF THE BUS BARS, THE CURED SILVER PASTE, AND THE COPPER PLATED BASE PLATES; ASSEMBLING THE ALUMINUM OXIDE WAFERS ON OPPOSITE SIDES OF THE THERMOELECTRIC MODULE WITH THE TINNED SILVER PASTE PATTERNS ENGAGING THE TINNED BUS BARS, AND ASSEMBLING THE BASE PLATES WITH THE TINNED COPPER PLATED FACES ENGAGING THE OTHER FACES OF THE ALUMINUM OXIDE WAFERS; AND APPLYING PRESSURE AND HEAT SUFFICIENT TO JOIN THE MODULE, WAFERS, AND BASE PLATES IN A UNITARY ASSEMBLY.
Claim 2
Independent Claim
164 words
THE METHOD OF MAKING A HEAT PUMP ASEMBLY OF COMPONENTS COMPRISING A THERMOELECTRIC MODULE HAVING HOT AND COLD JUNCTIONS DEFINED BY BUS BARS, FIRST AND SECOND ALUMINUM OXIDE WAFERS, AND FIRST AND SECOND BASE PLATES, COMPRISING THE STEPS OF: APPLYING CONDUCTIVE SILVER PASTE, TO ONE SIDE OF EACH WAFER IN PATTERNS WHICH MATCH THE BUS BAR PATTERNS, AND SUBSTANTIALLY ENTIRELY ACROSS THE OTHER SIDE OF EACH WAFER; APPLYING HEAT TO CURE THE SILVER PASTE; COPPER PLATING SUBSTANTIALLY AN ENTIRE FACE OF EACH BASE PLATE; TINNING WITH SOLDER THE FACES OF THE BUS BARS, THE CURED SILVER PASTE, AND THE COPPER PLATED BASE PLATES; ASSEMBLING THE ALUMINUM OXIDE WAFERS ON OPPOSITE SIDES OF THE THERMOELECTRIC MODULE WITH THE TINNED SILVER PASTE PATTERNS ENGAGING THE TINNED BUS BARS, AND ASSEMBLING THE BASE PLATES WITH THE TINNED COPPER PLATED FACES ENGAGING THE OTHER FACES OF THE ALUMINUM OXIDE WAFERS; AND APPLYING PRESSURE AND HEAT SUFFICIENT TO JOIN THE MODULE, WAFERS, AND BASE PLATES IN A UNITARY ASSEMBLY.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1969-04-25 | 1969-10-25 | 1970-04-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1973-04-25 | 1973-10-25 | 1974-04-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1977-04-25 | 1977-10-25 | 1978-04-26 | $7700.00 | Window Closed / Lapsed |