Stacked, laminated printed circuit assemblies

Claim 1

A STACKED, LAMINATED PRINTED CIRCUIT ASSEMBLY COMPRISING (A) AT LEAST TWO CONDUCTOR SUPPORTING DIELECTRIC FILMS OF THERMOPLASTIC MATERIAL ARRANGED IN SPACED SUPERPOSED RELATION, SAID SUPPORTING FILMS HAVING A PREDETERMINED MELTING TEMPERATURE, (B) NON-SELF SUPPORTING FOIL-LIKE CONDUCTOR MEANS ADHERED TO SAID CONDUCTOR SUPPORTING FILMS AND FORMING A PREDETERMINED EXPOSED CONDUCTOR PATTERN UPON SURFACE AREAS OF THE FILMS, (C) AT LEAST ONE OF SAID FOIL-LIKE CONDUCTOR MEANS BEING INTERPOSED BETWEEN SAID SPACED SUPERPOSED CONDUCTOR SUPPORTING FILMS, AND (D) A HEAT REFORMED BONDING DIELECTRIC FILM OF ANOTHER THERMOPLASTIC MATERIAL INTERPOSED BETWEEN SAID SPACED CONDUCTOR SUPPORTING FILMS, (E) SAID BONDING DIELECTRIC FILM HAVING A MELTING TEMPERATURE LOWER THAN SAID FIRST PREDETERMINED TEMPERATURE OF SAID CONDUCTOR SUPPORTING FILMS TO ACCOMMODATE HEAT REFORMATION AND HEAT-SEAL BONDING OF THE BONDING FILM DIRECTLY TO THE EXPOSED CONDUCTOR MEANS AND TO THE SURFACE AREAS OF THE CONDUCTOR SUPPORTING FILMS WITHOUT DISTORTION OF THE SUPPORTING FILMS AND WITHOUT AFFECTING THE ADHERENCE OF THE CONDUCTOR MEANS THERETO, (F) THE HEAT-REFORMED BONDING FILM EMBRACING SAID AT LEAST ONE CONDUCTOR MEANS AND BEING IN DIRECT HEATSEAL BONDED CONTACT WITH SAID AT LEAST ONE CONDUCTOR MEANS AND WITH EXPOSED SURFACE AREAS OF SAID CONDUCTOR SUPPORTING FILMS, (G) WHEREBY SAID AT LEAST ONE CONDUCTOR MEANS IS COMPLETELY ENVELOPED AND ELECTRICALLY INSULATED BY THE COOPERATION OF SAID BONDING FILM AND THE SUPPORTING FILM TO WHICH SAID CONDUCTOR IS ADHERED.