Patent US3239915A successfully refreshed from Google Patents.
US3239915A
Expired / Lapsed
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Method of forming embossed electric circuits
Assignee: Methode Electronics Inc
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Filing: 1961-09-11
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Granted: 1966-03-15
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Expires: 1981-09-11
Abstract
No abstract record available.
Inventors
- 👤 William J Mcginley
- 👤 Howard G Spannagel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 21:26
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/02; H05K3/04; H05K3/041; B; B26; B26F; B26F1/00; B26F1/38; B26F1/40; B29; B29C; B29C70/00; B29C70/58; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1054; Y10T156/12; Y10T156/1313; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49158; Y10T29/4916
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
178 words
THE METHOD OF DIE-CUTTING AND SIMULTANEOUSLY ADHESIVELY SECURING FOIL CIRCUIT ELEMENTS TO A DIELECTRIC BASE WHICH CONSISTS IN PROVIDING A PUNCH PRESS WITH A MECHANICALLY DRIVEN RECIPROCATING RAM CARRYING A HEATED CUTTING DIE, PROVIDING A WORKPIECE SUPPORT CAPABLE OF ADVANCING WITH THE RETREATING STROKE OF THE RAM OF THE PRESS, SUPERPOSING ON A THERMOSET DIELECTRIC BASE A SHEET OF METALLIC FOIL AND A THERMOSETTING ADHESIVE BETWEEN THE FOIL AND THE BASE, PLACING THE BASE AND FOIL ASSEMBLY ON THE WORKPIECE SUPPORT AND BENEATH THE DIE, DRIVING THE RAM TO FORCE THE DIE INTO THE FOIL TO SEVER CIRCUIT ELEMENTS FROM THE REMAINDER OF THE SHEET AND FORCE THE CIRCUIT ELEMENTS INTO CONTACT WITH THE DIELECTRIC BASE, THEN APPLYING UPWARD PRESSURE TO RAISE THE SUPPORT TO MAINTAIN HEAT AND PRESSURE CONTACT OF THE DIE WITH THE FOIL DURING THE RETREATING STROKE OF THE RAM AND MAINTAINING THE HEAT AND PRESSURE CONTACT FOR A DWELL PERIOD OF SUFFICIENT DURATION TO CURE THE ADHESIVE TO A THERMOSET CONDITION, AND SUBSEQUENTLY LOWERING THE SUPPORT BY RELEASING THE PRESSURE ON THE WORKPIECE SUPPORT.
Claim 2
Independent Claim
178 words
THE METHOD OF DIE-CUTTING AND SIMULTANEOUSLY ADHESIVELY SECURING FOIL CIRCUIT ELEMENTS TO A DIELECTRIC BASE WHICH CONSISTS IN PROVIDING A PUNCH PRESS WITH A MECHANICALLY DRIVEN RECIPROCATING RAM CARRYING A HEATED CUTTING DIE, PROVIDING A WORKPIECE SUPPORT CAPABLE OF ADVANCING WITH THE RETREATING STROKE OF THE RAM OF THE PRESS, SUPERPOSING ON A THERMOSET DIELECTRIC BASE A SHEET OF METALLIC FOIL AND A THERMOSETTING ADHESIVE BETWEEN THE FOIL AND THE BASE, PLACING THE BASE AND FOIL ASSEMBLY ON THE WORKPIECE SUPPORT AND BENEATH THE DIE, DRIVING THE RAM TO FORCE THE DIE INTO THE FOIL TO SEVER CIRCUIT ELEMENTS FROM THE REMAINDER OF THE SHEET AND FORCE THE CIRCUIT ELEMENTS INTO CONTACT WITH THE DIELECTRIC BASE, THEN APPLYING UPWARD PRESSURE TO RAISE THE SUPPORT TO MAINTAIN HEAT AND PRESSURE CONTACT OF THE DIE WITH THE FOIL DURING THE RETREATING STROKE OF THE RAM AND MAINTAINING THE HEAT AND PRESSURE CONTACT FOR A DWELL PERIOD OF SUFFICIENT DURATION TO CURE THE ADHESIVE TO A THERMOSET CONDITION, AND SUBSEQUENTLY LOWERING THE SUPPORT BY RELEASING THE PRESSURE ON THE WORKPIECE SUPPORT.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1969-03-14 | 1969-09-13 | 1970-03-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1973-03-14 | 1973-09-13 | 1974-03-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1977-03-14 | 1977-09-13 | 1978-03-15 | $7700.00 | Window Closed / Lapsed |