Encapsuled semiconductor device and method of its manufacture

Claim 1

AN ELECTRONIC SEMICONDUCTOR DEVICE COMPRISING A SEMICONDUCTOR MEMBER HAVING AN AXIS AND TWO RIGID AND MASSIVE CONNECTOR ELECTRODES JOINED FACE-TO-FACE WITH SAID SEMICONDUCTOR MEMBER ON OPPOSITE RESPECTIVE SIDES THEREOF, EACH OF SAID ELECTRODES HAVING A COEFFICIENT OF EXPANSION CORRESPONDING TO THAT OF SAID SEMICONDUCTOR MEMBER AND HAVING A THICKNESS WHICH IS GREATER THAN THE THICKNESS OF SAID SEMICONDUCTOR MEMBER ALONG THE SEMICONDUCTOR MEMBER AXIS, AN ELECTRICALLY INSULATING RING-SHAPED FRAME STRUCTURE SURROUNDING SAID SEMICONDUCTOR MEMBER AND SAID ELECTRODES, AND TWO FLAT DISC-SHAPED METAL WALL STRUCTURES IN ABUTTING ELECTRICAL CONTACT WITH SAID RESPECTIVE ELECTRODES AND JOINED WITH SAID FRAME STRUCTURE AT OPPOSITE RESPECTIVE SURFACES THEREOF, SAID WALL STRUCTURES AND SAID FRAME STRUCTURE JOINTLY FORMING A SEALED HOUSING ENCAPSULING SAID SEMICONDUCTOR MEMBER, SAID INSULATING FRAME STRUCTURE INCLUDING WITHIN ITS INNER MARGINAL ZONE A GUIDE ADAPTED TO THE PERIPHERY OF THE SEMICONDUCTOR MEMBER FOR MAINTAINING THE POSITION OF THE SEMICONDUCTOR MEMBER.