Patent US3230625A successfully refreshed from Google Patents.
US3230625A
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Method and apparatus for scoring semiconductor plates to be broken into smaller bodies
Assignee: Siemens Schuckertwerke AG
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Filing: 1962-11-16
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Granted: 1966-01-25
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Expires: 1982-11-16
Abstract
No abstract record available.
Inventors
- 👤 Meyer August
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 20:49
CPC Classifications
B; B28; B28D; B28D5/00; B28D5/0005; B28D5/0011; Y; Y10; Y10T; Y10T225/00; Y10T225/10; Y10T225/12
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
65 words
THE METHOD OF SCORING SILICON AND GERMANIUM SEMICONDUCTOR PLATES TO BE BROKEN INTO SMALLER BODIES ALONG SCORE LINES, WHICH COMPRISES PRESSING A SCORING TOOL BY STORED FORCE AGAINST THE PLATE SURFACE AT SUBSTANTIALLY CONSTANT CONTACT PRESSURE OF ABOUT 50 TO 200 GRAMS, AND PASSING THE TOOL UNDER SAID PRESSURE OVER THE SEMICONDUCTOR SURFACE AT SUBSTANTIALLY CONSTANT SPEED BETWEEN ABOUT 1 AND 5 CM. PER SECOND.
Claim 2
Independent Claim
65 words
THE METHOD OF SCORING SILICON AND GERMANIUM SEMICONDUCTOR PLATES TO BE BROKEN INTO SMALLER BODIES ALONG SCORE LINES, WHICH COMPRISES PRESSING A SCORING TOOL BY STORED FORCE AGAINST THE PLATE SURFACE AT SUBSTANTIALLY CONSTANT CONTACT PRESSURE OF ABOUT 50 TO 200 GRAMS, AND PASSING THE TOOL UNDER SAID PRESSURE OVER THE SEMICONDUCTOR SURFACE AT SUBSTANTIALLY CONSTANT SPEED BETWEEN ABOUT 1 AND 5 CM. PER SECOND.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1969-01-24 | 1969-07-26 | 1970-01-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1973-01-24 | 1973-07-26 | 1974-01-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1977-01-24 | 1977-07-26 | 1978-01-25 | $7700.00 | Window Closed / Lapsed |