Patent US3177103A successfully refreshed from Google Patents.
US3177103A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Two pass etching for fabricating printed circuitry
Assignee: SAUDERS ASSOCIATES Inc
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Filing: 1961-09-18
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Granted: 1965-04-06
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Expires: 1981-09-18
Abstract
No abstract record available.
Inventors
- 👤 Sidney K Tally
- 👤 George S Price
- 👤 George F Gordon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 21:03
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/20; H05K3/202; C; C23; C23F; C23F1/00; C23F1/02; H05K3/02; H05K3/06; H05K3/22; H05K3/28; H05K3/281; H05K1/00; H05K1/02; H05K1/03; H05K1/0393; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0152; H05K2203/03; H05K2203/0315; H05K2203/0369; H05K2203/0376; H05K3/38; H05K3/382; H05K3/385
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
196 words
THE METHOD OF MAKING A UNITARY ELECTRICAL CONDUCTOR ELEMENT FOR ELECTRICAL APPARATUS HAVING THE FORM OF A FREELY FLEXIBLE SHEET AND PROVIDING A PLURALITY OF DISCRETE CONDUCTING PATHS COMPRISING THE FOLLOWING STEPS: (A) ETCHING PARTIALLY THROUGH A SHEET OF FOIL TO LEAVE AN EMBOSSED CIRCUIT PATTERN ON SAID FOIL, (B) POSITIONING SAID FOIL WITH ITS EMBOSSED FACE IN CONTACT WITH A FLEXIBLE BASE SHEET OF THERMOPLASTIC RESINOUS INSULATING MATERIAL AND BY HEAT AND PRESSURE CAUSING SAID SHEET OF FOIL TO BOND TO SAID SHEET OF THERMOPLASTIC TO THEEREBY LOCK SAID CIRCUIT PATTERN IN POSITION TO MAINTAIN SAID CIRCUIT PATTERN''S DIMENSIONAL STABILITY DURING SUBSEQUENT PROCESSING, (C) ETCHING THROUGH SAID FOIL FROM THE SIDE WHICH HAS NOT YET BEEN ETCHED UNTIL THE CIRCUIT PATTERN BECOMES DISCRETE, (D) PLACING A COVERING OF SUBSTANTIALLY SIMILAR FLEXIBLE THERMOPLASTIC AS SAID BASE OVER SAID BASE AND DISCRETE CIRCUIT PATTERN, AND (E) APPLYING HEAT AND PRESSURE TO CAUSE SAID COVERING TO FLOW INTO EXPOSED AREAS OF SAID BASE TO EFFECT A BOND OF THE SURFACE OF SAID COVERING TO THE SURFACE OF THE EXPOSED AREAS AND SAID CIRCUIT PATTERN, SAID CIRCUIT PATTERN MAINTAINING ITS DIMENSIONAL STABILITY DURING THE APPLICATION OF HEAT AND PRESSURE.
Claim 2
Independent Claim
196 words
THE METHOD OF MAKING A UNITARY ELECTRICAL CONDUCTOR ELEMENT FOR ELECTRICAL APPARATUS HAVING THE FORM OF A FREELY FLEXIBLE SHEET AND PROVIDING A PLURALITY OF DISCRETE CONDUCTING PATHS COMPRISING THE FOLLOWING STEPS: (A) ETCHING PARTIALLY THROUGH A SHEET OF FOIL TO LEAVE AN EMBOSSED CIRCUIT PATTERN ON SAID FOIL, (B) POSITIONING SAID FOIL WITH ITS EMBOSSED FACE IN CONTACT WITH A FLEXIBLE BASE SHEET OF THERMOPLASTIC RESINOUS INSULATING MATERIAL AND BY HEAT AND PRESSURE CAUSING SAID SHEET OF FOIL TO BOND TO SAID SHEET OF THERMOPLASTIC TO THEEREBY LOCK SAID CIRCUIT PATTERN IN POSITION TO MAINTAIN SAID CIRCUIT PATTERN''S DIMENSIONAL STABILITY DURING SUBSEQUENT PROCESSING, (C) ETCHING THROUGH SAID FOIL FROM THE SIDE WHICH HAS NOT YET BEEN ETCHED UNTIL THE CIRCUIT PATTERN BECOMES DISCRETE, (D) PLACING A COVERING OF SUBSTANTIALLY SIMILAR FLEXIBLE THERMOPLASTIC AS SAID BASE OVER SAID BASE AND DISCRETE CIRCUIT PATTERN, AND (E) APPLYING HEAT AND PRESSURE TO CAUSE SAID COVERING TO FLOW INTO EXPOSED AREAS OF SAID BASE TO EFFECT A BOND OF THE SURFACE OF SAID COVERING TO THE SURFACE OF THE EXPOSED AREAS AND SAID CIRCUIT PATTERN, SAID CIRCUIT PATTERN MAINTAINING ITS DIMENSIONAL STABILITY DURING THE APPLICATION OF HEAT AND PRESSURE.
References Cited (Backward Citations)
US378423A
Cited
US2997521A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1968-04-05 | 1968-10-05 | 1969-04-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1972-04-05 | 1972-10-05 | 1973-04-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1976-04-05 | 1976-10-05 | 1977-04-06 | $7700.00 | Window Closed / Lapsed |