Method of mounting a semiconductor device

Claim 1

THE METHOD OF MOUNTING A SURFACE ALLOYED SEMICONDUCTOR DEVICE INCLUDING AT LEAST ONE LEAD-CONTAINING FUSED ELECTRODE, COMPRISING THE STEPS OF BONDING SAID ELECTRODE DIRECTLY TO ONE FACE OF A METAL PLATE, SAID PLATE BEING RELATIVELY SMALL COMPARED TO SAID DEVICE, SAID METAL BEING SELECTED FROM THE GROUP CONSISTING OF NICKEL, CHROMIUM, RHODIUM, PLATINUM, OSMIUM, IRIDIUM, PALLADIUM, AND ALLOYS OF THESE METALS, DEPOSITING A LAYER OF INDIUM ON THE OPPOSITE FACE OF SAID PLATE, SHAVING SAID LAYER TO EXPOSE A FRESH FLAT INDIUM SURFACE, DEPOSITING A LAYER OF INDIUM ON A SUPPORTING BASE, SHAVING SAID INDIUM LAYER ON SAID BASE TO EXPOSE A FRESH FLAT INDIUM SURFACE, AND UNITING SAID INDIUM LAYERS BY PRESSING ONE IN CONTACT WITH THE OTHER.