Wafers for modular constructions

Claim 1

A SMALL CERAMIC WAFER FOR USE IN ELECTRICAL ASSEMBLIES OF MODULAR CONSTRUCTION CHARACTERIZED AS BEING OF GENERALLY SQUARE CONFIGURATION, SAID WAFER HAVING ESSENTIALLY THE SAME HEIGHT AND LENGTH OF A DIMENSION UNDER THREE-QUARTERS OF AN INCH, SAID WAFER HAVING A VERY SMALL THICKNESS DIMENSION, EACH OF THE SIDE EDGES OF SAID WAFER BEING FORMED WITH A PLURALITY OF NOTCHES SYMMETRICALLY DISPOSED INTERMEDIATE THE CORNERS OF SAID WAFER IN IDENTICALLY PREDETERMINED SPACED RELATIONSHIP TO EACH OTHER AND TO SAID CORNERS, AT LEAST TWO CORNERS OF SAID WAFER ADJACENT TO ONE SIDE EDGE BEING RELIEVED IN AN ASYMMETRICAL MANNER TO PROVIDE MEANS FOR POSITIVE ORIENTATION THEREOF, THE RELIEVED AREAS EACH BEING GENERALLY OF TRIANGULAR CONFIGURATION TO PROVIDE A WAFER BODY HAVING FIRST AND SECOND SHARPLY DIVERGENT MARGINAL SURFACES ON THE CORNERS ADJACENT SAID ONE SIDE EDGE, THE DIMENSIONS OF THE RELIEVED CORNER AREAS AS MEASURED IN THE PLANE OF SAID ONE SIDE EDGE BEING LESS THAN SAID PREDETERMINED SPACING OF SAID NOTCHES.