Semiconductor devices and method of manufacture

Claim 1

IN THE MANUFACTURE OF A SEMICONDUCTOR DEVICE HAVING A BODY OF SEMICONDUCTIVE MATERIAL, THE METHOD OF FORMING AN INTEGRAL METALLIC CONTACT AND LEAD ASSEMBLY HAVING A CONTACT BONDED TO SAID BODY AND A LEAD PROJECTING THEREFROM COMPRISING THE STEPS OF APPLYING A COATING OF PHOTOSENSITIVE RESIST MATERIAL TO A SURFACE OF SAID BODY, MASKING AN AREAL REGION OF SAID COATING CORRESPONDING TO SAID CONTACT AND LEAD ASSEMBLY, EXPOSING SAID COATING TO LIGHT TO HARDEN THE UNMASKED REGIONS THEREOF, REMOVING SAID COATING IN SAID AREAL REGION TO EXPOSE THE CORRESPONDING AREAL REGION OF SAID SURFACE, APPLYING A METALLIC LAYER TO SAID AREAL REGION OF SAID SURFACE TO FORM SAID CONTACT AND LEAD ASSEMBLT BONDED THROUGHOUT TO SAID BODY, REMOVING SAID COATING IN THE UNMASKED REGIONS THEREOF, APPLYING A PROTECTIVE COATING TO THE PORTION OF SAID METALLIC LAYER CORRESPONDING TO SAID CONTACT LEAVING THE LEADUNDERLYING AND LEAD-ADJACENT PORTIONS OF SAID BODY UNPROTECTED, AND ETCHING SAID LEAD-UNDERLYING AND LEAD-ADJACENT PORTIONS OF SSAID BODY TO FREE SAID LEAD FROM SAID BODY.