Patent US3065538A successfully refreshed from Google Patents.
US3065538A
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Soldering method and composition
Assignee: Kuppers Metallwerk GmbH
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Filing: 1957-11-29
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Granted: 1962-11-27
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Expires: 1977-11-29
Abstract
No abstract record available.
Inventors
- 👤 Melchiors Horst
- 👤 Witte Georg
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 15:43
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/36; B23K35/3612; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49147; Y10T29/49149
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
128 words
IN THE METHOD FOR SOLDERING LUGS TO THE CONDUCTIVE METAL FORMING A CIRCUIT ON A NON-CONDUCTIVE BASE BY APPLYING THE SOLDER AS A SOLDER PASTE TO THE LUGS AND THEREAFTER HEATING THE LUGS TO CAUSE THE PASTE TO FLOW DOWN THE LUGS AND FUSE AT THE POINTS OF CONTACT BETWEEN THE LUGS AND THE CONDUCTIVE METAL, THE IMPROVEMENT WHICH COMPRISES EMPLOYING A SOLDER PASTE COMPRISING A MIXTURE OF 88% OF A TIN-LEAD SOLDER PASELECTED FROM THE GROUP CONSISTING OF 50% TIN-50% LEAS ALLOY SOLDER, 60% TIN40% LEAD ALLOY SOLDER AND 20% TIN-80% LEAD ALLOY SOLDER, 7.5% COLOPHONY, 0.3% GLYCOCOLETHYLESTERHYDROCHLORIDE, 0.2% BORNYLACETATE, AND 4% OF A SOLVENT SELECTED FROM THE GROUP CONSISTING OF DIMETHYLPHTHALATE, METHYLBENZYL ALCOHOL, TETRALIN (2.5%) AND PINE OIL (1.5%), AND BUTYLENE GLYCOL (2%) AND TERPINOL (2%).
Claim 2
Dependent Claim
128 words
IN THE METHOD FOR SOLDERING LUGS TO THE CONDUCTIVE METAL FORMING A CIRCUIT ON A NON-CONDUCTIVE BASE BY APPLYING THE SOLDER AS A SOLDER PASTE TO THE LUGS AND THEREAFTER HEATING THE LUGS TO CAUSE THE PASTE TO FLOW DOWN THE LUGS AND FUSE AT THE POINTS OF CONTACT BETWEEN THE LUGS AND THE CONDUCTIVE METAL, THE IMPROVEMENT WHICH COMPRISES EMPLOYING A SOLDER PASTE COMPRISING A MIXTURE OF 88% OF A TIN-LEAD SOLDER PASELECTED FROM THE GROUP CONSISTING OF 50% TIN-50% LEAS ALLOY SOLDER, 60% TIN40% LEAD ALLOY SOLDER AND 20% TIN-80% LEAD ALLOY SOLDER, 7.5% COLOPHONY, 0.3% GLYCOCOLETHYLESTERHYDROCHLORIDE, 0.2% BORNYLACETATE, AND 4% OF A SOLVENT SELECTED FROM THE GROUP CONSISTING OF DIMETHYLPHTHALATE, METHYLBENZYL ALCOHOL, TETRALIN (2.5%) AND PINE OIL (1.5%), AND BUTYLENE GLYCOL (2%) AND TERPINOL (2%).
Claim 3
Dependent Claim
5 words
A SOLDERING PASTE CONSISTING OF
Claim 4
Dependent Claim
5 words
A SOLDERING PASTE CONSISTING OF
References Cited (Backward Citations)
US1882734A
Cited
US2090846A
Cited
US2157918A
Cited
US2334609A
Cited
US2553226A
Cited
US2471451A
Cited
US2502291A
Cited
US2461754A
Cited
US2480903A
Cited
US2598027A
Cited
US2892191A
Cited
US2915678A
Cited
US2889393A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1965-11-26 | 1966-05-28 | 1966-11-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1969-11-26 | 1970-05-28 | 1970-11-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1973-11-26 | 1974-05-28 | 1974-11-27 | $7700.00 | Window Closed / Lapsed |