Room temperature curing molding and forming composition

Claim 1

A ROOM TEMPERATURE CURING RESINOUS MOLDING AND FORMING COMPOSITION COMPRISING: A MIXTURE OF FINELY DIVIDED METAL PARTICLES AND A LIQUID RESIN IN A VOLUMETRIC METAL-TO-RESIN RATIO OF APPROXIMATELY 32%-90% METAL TO 68%-10% RESIN; SAID METAL BEING IN THE RELATIVELY PURE ELEMENTAL STATE AND HAVING CHARACTERISTICS OF SPECIFIF HEAT THERMAL CONDUCTIVITY AND SURFACE TEXTURE OF MATERIALS BELONGING TO THE CLASS CONSISTING OF STEEL, IRON, COPPER ALUMINUM AND LEAD, SAID RESIN COMPRISING A CONDENSATION PRODUCT OF BIS-PHENOL AND EPICHLOROHYDRIN TOGETHER WITH A ROOM TEMPERATURE CURING AGENT THEREFOR COMPRISINF A LOWER ALIPHATIC POLYAMINE, AND A TOUGHENING AGENT; SAID CURING AGENT BEING PRESENT IN A QUANTITY SUFFICIENT SUBSTANTIALLY COMPLETELY TO COMBINE WITH CURE SAID RESIN AND SAID TOUGHENING AGENT HAVING THE CHARACTERISTICS OF CHEMICALLY COMBINING WITH AND TOUGHENING SAID RESIN OF THE CLASS CONSISTING IN A CONDENSATION PRODUCT OF UNSATRURATED FATTY ACID AND POLYALKYL AMINE, A LIQUID POLYTHIODITHIOL POLYMER, AND A DEHYDROABIETHYLAMINE; SAID METAL BEING UNIFORMLY DISTRIBUTED THROUGHOUT SAID RESIN A THICKENING AGENT IN SAID MIXTURE COMPRISING SOLID PARTICLES OF FINELY DIVIDED, HIGHLY ADSORPTIVE MATERIAL IN QUANTITY SUFFICIENT TO HOLD SAID METAL IN SUSPENSION PRIOR TO SAID CURING; AND SAID MIXTURE BEING 100% VOLATILE FREE.