Heat resistant liquid resin composition from phenol, formaldehyde and dicyandiamide, and process for making same

Claim 1

AN AQUEOUS-SOLVATED, LIQUID, WATER-DILUTABLE, FUSIBLE DICYANDIAMIDE-FORMALEDHYDE RESIN COMPOSITION IN SINGLE PACKAGE FORM ADAPTED FOR SHIPPING AND STORING THEREOF AND EXHIBITING IMPROVED WATER-DILUTABILITY RETENTION, THE SAID COMPOSITION COMPRISING AN AQUEOUS-SOLVATED, LIQUID, WATER-DILUTABLE, FUSIBLE MIXTURE OF CONDENSATES OF DICYANDIAMIDE-FORMALDEHYDE AND PHENOL-FORMALDEHYDE OF THE TYPE RESULTING FROM REACTING 1.0 MOL OF DICYANDIAMIDE AND 0.5-2.0 MOLS OF FORMALDEHYDE IN MOL RATIO IN THE PRESENCE OF AN ALKALINE-CATALYZED WATER-DILUTABLE REACTION MIXTURE OF PHENOL-FORMALEDHYDE AT A PH OF 5.0-10.0 AND A TEMPEATURE OF 40*-100*C. UNTIL A WATER-DILUTABLE, LIQUID PARTIAL CONDENSATE OF DICYANDIAMIDE AND FORMALDEHYDE IS FORMED AS DETERMINED BY THE SAID PARTIAL CONDENSATE PHOBING IN A QUANTITY OF WATER, THE SAID PHENOLFORMALDEHYDE REACTION MIXTURE BEING CONSTITUTED OF 1.0 MOL OF PHENOL TO 0.8-3.0 MOLS OF FORMALDEHYDE IN MOL RATIO.