Plating nickel on aluminum

Claim 1

IN A METHOD OF DEPOSITING AN ELECTROPLATE OF A NICKEL GROUP METAL UPON ARTICLES OF ALUMINUM AND ALUMINUMBASE ALLOYS, THE STEPS WHICH INCLUDE DEGREASING THE ARTICLE, RISING IN WATER, SUBJECTING THE ARTICLE TO TWO ETCHING ACTIONS, THE FIRST, DIPPING IN HYDROFLUORIC ACID, RISING IN WATER, AND THE SECOND, DKPPING IN A SOLUTION OF HYDROCHLORIC ACID CONTAINING MANGANOUS SULFATE, THE TOTAL ETCHING TIME VARYING FROM 10 TO 80 SECONDS, RINSING IN WATER, CATHODICALLY TREATING THE ARTICLE IN AN AQUEOUS NICKEL BATH COMPRISING NICKEL SULFATE, MAGNESIUM SULFATE, AMMONIUM CHLORIDE, AND BORIC ACID AND SUBJECTING THE BATH TO A CURRENT DENSITY OF CIRCA 15 AMPERES PER SQUARE FOOT FOR A PERIOD OF APPROXIMATELY 10 MINUTES, ELECTRODEPOSITING A LAYER OF NICKEL ON THE ARTICLE AND CONTROLLING THE ELECTRODEPOSITION TO PRODUCE A THICKNESS WHICH RANGES FROM 0.0001 INCH TO 0.0005 INCH, RINSING IN WATER AND THEN PARTIALLY DRYING WITH AN AIR BLAST, HEAT TREATING THE COMPOSITE PLATED ARTICLE AT A TEMPERATURE OF ABOUT 1000*F. FOR A PERIOD OF 21/2 TO 5 MINUTES, THEN REMOVING THE LIGHT BLUE OXIDE THAT FORMS THERON DURING THE HEAT TREATING STEP BY ANODICALLY TREATING THE COMPOSITE PLATED ARTICLE IN A SOLUTION OF SODIUM HYDROXIDE AND SODIUM CARBONATE, RISING IN WATER, SUBJECTING THE COMPOSITE PLATED ARTICLE TO A REVERSE CURRENT TREATMENT IN SULFURIC ACID, RISING IN WATER, AND THEREAFTER ELECTRICALLY DEPOSITING A METAL UPON THE COMPOSITE PLATED ARTICLE OTHER THAN NICKEL.