Patent US2947064A successfully refreshed from Google Patents.
US2947064A
Expired / Lapsed
US
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Method of interconnecting pathway patterns of printed circuit products by chemical deposition
Assignee: Technograph Printed Electronics Inc
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Filing: 1956-03-06
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Granted: 1960-08-02
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Expires: 1976-03-06
Abstract
No abstract record available.
Inventors
- 👤 John B Langton
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 17:12
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/2006; C23C18/2046; C23C18/2073; C23C18/208; C23C18/22; C23C18/28; C23C18/30; C23C18/31; C23C18/38; C23C18/40; H; H05; H05K; H05K3/00; H05K3/40; H05K3/42; H05K3/422; Y; Y10; Y10S; Y10S228/00; Y10S228/903; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
147 words
IN A METHOD OF METALLICALLY JOINING THE METAL LAYERS OF TWO-SIDEDLY METAL-CLAD INSULATION MATERIAL OF THE TYPE USED AS STOCK MATERIAL IN THE MANUFACTURE OF PRINTED CIRCUIT PRODUCTS, WHEREIN HOLES ARE FORMED THROUGH THE METAL-CLAD INSULATION, THE STEP OF COATING THE WALL SURFACE DEFINING SAID HOLES, WHICH COMPRISES, EXPOSING THE SAID WALL SURFACE TO THE ACTION OF AN AQUEOUS SOLUTION COMPOSED OF APPROXIMATELY 0.2 GRAM OF PALLADIUM CHLORIDE AND 3 CC. OF HYDROCHLORIC ACID PER LITER, AND THEN TO THE ACTION OF AN AQUEOUS SOLUTION COMPOSED OF 2.65 GRAMS TO 15.9 GRAMS OF COPPER TARTRATE, 4.85 GRAMS TO 21.9 GRAMS OF ROCHELLE SALT, AND 9 GRAMS OF SODIUM HYDORXIDE PER LITER IN THE PRESENCE OF A REDUCING AGENT AT A TEMPERATURE IN THE APPROXIMATE RANGE OF 70*-90*F., WHEREBY THE COPPER IS REDUCED FROM THE SOLUBLE STATE AND DEPOSITS OUT AS A CONDUCTIVE LAYER ON SAID WALL SURFACE.
Claim 2
Dependent Claim
147 words
IN A METHOD OF METALLICALLY JOINING THE METAL LAYERS OF TWO-SIDEDLY METAL-CLAD INSULATION MATERIAL OF THE TYPE USED AS STOCK MATERIAL IN THE MANUFACTURE OF PRINTED CIRCUIT PRODUCTS, WHEREIN HOLES ARE FORMED THROUGH THE METAL-CLAD INSULATION, THE STEP OF COATING THE WALL SURFACE DEFINING SAID HOLES, WHICH COMPRISES, EXPOSING THE SAID WALL SURFACE TO THE ACTION OF AN AQUEOUS SOLUTION COMPOSED OF APPROXIMATELY 0.2 GRAM OF PALLADIUM CHLORIDE AND 3 CC. OF HYDROCHLORIC ACID PER LITER, AND THEN TO THE ACTION OF AN AQUEOUS SOLUTION COMPOSED OF 2.65 GRAMS TO 15.9 GRAMS OF COPPER TARTRATE, 4.85 GRAMS TO 21.9 GRAMS OF ROCHELLE SALT, AND 9 GRAMS OF SODIUM HYDORXIDE PER LITER IN THE PRESENCE OF A REDUCING AGENT AT A TEMPERATURE IN THE APPROXIMATE RANGE OF 70*-90*F., WHEREBY THE COPPER IS REDUCED FROM THE SOLUBLE STATE AND DEPOSITS OUT AS A CONDUCTIVE LAYER ON SAID WALL SURFACE.
References Cited (Backward Citations)
US2616994A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1963-08-02 | 1964-02-01 | 1964-08-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1967-08-02 | 1968-02-01 | 1968-08-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1971-08-02 | 1972-02-01 | 1972-08-02 | $7700.00 | Window Closed / Lapsed |