Room temperature curing silicone

Claim 1

A RESINOUS COMPOSITION CAPABLE OF CURING IN A THIN FILM AT ROOM TEMPERATURE IN AIR IN 24 HOURS WHICH COMPRISES THE REACTION PRODUCT OF A MIXTURE OF TWO ORGANOPOLYSILOXANE COMPONENTS IN EACH OF WHICH EACH ORGANOPOLYSILOXANE HAS ATTACHED TO THE SILICON ATOMS BY SILICONCARBON BONDS AN AVERAGE PER SILICON ATOM OF FROM 1.2 TO 1.7 MONOVALENT HYDROCARBON RADICALS OF WHICH FROM 0.25 TO 1 RADICAL PER SILICON ATOM IS THE PHENYL RADICAL AND THE REMAINDER ARE ALKYL RADICALS OF LESS THAN SEVEN CARBON ATOMS, ONE ORGANOPOLYSILOXANE COMPONENT (A) BEING COMPOSED OF ORGANOPOLYSILOXANE EACH OF WHICH HAS FROM 0.5 TO 1.25 PERCENT BY WEIGHT SILICON-BONDED HYDROXYLS AND THE OTHER ORGANOPOLYSILOXANE COMPONENT (B) BEING COMPOSED OF ORGANOPOLYSILOXANE EACH OF WHICH HAS FROM 1.5 TO 5 PERCENT BY WEIGHT SILICON-BONDED HYDROXYL GROUPS, COMPONENTS (A) AND (B) BEING PRESENT IN SUCH PROPORTIONS THAT A 50 PERCENT BY WEIGHT SOLUTION IN XYLENE OF THE TOTAL ORGANOPOLYSILOXANES HAS A VISCOSITY OF FROM 50 TO 150 CPS. AT 25*C., AND FROM ONE TO THREE MOLECULES PER SILICON-BONDED HYDROXYL GROUP CONTAINED IN THE TOTAL ORGANOPOLYSILOXANES A AND B OF AN ORGANOSILANE OF THE FORMULA RSI(OZ)3 IN WHICH EACH R IS A MONOVALENT HYDROCARBON OF LESS THAN FOUR CARBON ATOMS AND EACH Z IS AN ACYL RADICAL OF LESS THAN FOUR CARBON ATOMS.