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US2911773A
Expired / Lapsed
US
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Method of cutting semiconductive material
Assignee: TDK Micronas GmbH
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Filing: 1957-06-18
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Granted: 1959-11-10
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Expires: 1977-06-18
Abstract
No abstract record available.
Inventors
- 👤 Andre R Gobat
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 21:01
CPC Classifications
B; B28; B28D; B28D5/00; B28D5/02; B28D5/022; H; H10; H10P; H10P95/00
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1962-11-09 | 1963-05-11 | 1963-11-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1966-11-09 | 1967-05-11 | 1967-11-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1970-11-09 | 1971-05-11 | 1971-11-10 | $7700.00 | Window Closed / Lapsed |