Method and apparatus for electrodeposition of a layer of uniform thickness on a conductive surface

Claim 1

IN APPARATUS FOR THE ELECTRO-DEPOSITION OF A METALLIC LAYER OF CONSTANT THICKNESS UPON AN ELECTRICALLY CONDUCTIVE SURFACE HAVING CONVEYOR ADAPTED FOR SUPPORTING AND CONVEYING THE SAID SURFACE ALONG A PREDETERMINED PATH AND PAST AN ELECTRO-DEPOSITING STATION FOR PRESENTING SUCESSIVE AREAS OF THE CONDUCTIVE SURFACE AT SAID STATION, A SUPPLY TANK CONTAINING AN ELECTROLYTIC BATH, A POSITIVE ELECTRODE DISPOSED IN THE SUPPLY TANK AND IMMERSED IN THE BATH, AN APPLICATOR CONNECTED TO SAID SUPPLY TANK, A NEGATIVE ELECTRODE CONNECTED TO THE ELECTRICALLY CONDUCTIVE SURFACE AND WITH THE ELECTROLYTE ON SAID SURFACE, AND MEANS TO CONNECT A SOURCE OF ELECTRICITY TO THE POSITIVE AND NEGATIVE ELECTRODES, SAID APPLICATOR COMPRISING A NOZZLE FOR PROJECTING SAID ELECTROLYTE ONTO THE CONDUCTIVE SURFACE AT SAID STATION, AND INCLUDING DEPENDING MEANS ATTACHED TO THE EDGES OF SAID NOZZLE, SAID APPLICATOR BEING MOUNTED AT SAID STATION AND RELATIVE TO SAID CONVEYOR SO THAT SAID DEPENDING MEANS SUBSTANTIALLY CONFINES THE ELECTROLYTE TO SAID STATION WITHOUT CONTACTING SAID CONDUCTIVE SURFACE.