Patent US2703295A successfully refreshed from Google Patents.
US2703295A
Expired / Lapsed
US
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Nonelectrolytic method for making bimetallic offset printing copper plating composition and method of plating
Assignee: Individual
•
Filing: 1952-10-07
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Granted: 1955-03-01
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Expires: 1972-10-07
Abstract
No abstract record available.
Inventors
- 👤 Morris S Kantrowitz
- 👤 Alden E Yelmgren
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 02:06
CPC Classifications
B; B41; B41N; B41N1/00; B41N1/04; B41N1/08; B41N1/10
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
37 words
A COPPER PLANTING COMPOSITION COMPRISING AN AQUEOUS SOLUTION CONTAINING ABOUT 2 TO 5 PER CENT OF AMMONIUM HYDROXIDE, ABOUT 5 TO 10 PER CENT OF NEUTRALIZED COPPER SULFATE, AND ABOUT 4 TO 6 PER CENT OF PYROGALLOL.
Claim 2
Dependent Claim
37 words
A COPPER PLANTING COMPOSITION COMPRISING AN AQUEOUS SOLUTION CONTAINING ABOUT 2 TO 5 PER CENT OF AMMONIUM HYDROXIDE, ABOUT 5 TO 10 PER CENT OF NEUTRALIZED COPPER SULFATE, AND ABOUT 4 TO 6 PER CENT OF PYROGALLOL.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1958-02-28 | 1958-08-30 | 1959-03-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1962-02-28 | 1962-08-30 | 1963-03-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1966-02-28 | 1966-08-30 | 1967-03-01 | $7700.00 | Window Closed / Lapsed |