Electrodeposition of nickel

Claim 1

A NICKEL PLATING SOLUTION ESSENTIALLY CONSISTING OF AN AQUEOUS ACID SOLUTION OF NICKEL MATERIAL SUPPLYING NICKEL IONS AND AN ADDITION AGENT DISSOLVED IN SAID SOLUTION AND CAPABLE OF IMPARTING TO DEPOSITS PRODUCED THEREIN IMPROVED SMOOTHNESS AND BUFFABILITY, SAID SOLUTION ESSENTIALLY CONSISTING OF A COMPOSITION OF THE CLASS CONSISTING OF AQUEOUS SOLUTIONS OF NICKEL SULFATE, AQUEOUS SOLUTIONS OF NICKEL SULFATE AND NICKEL CHLORIDE, AQUEOUS SOLUTIONS OF NICKEL FLUOBORATE, AQUEOUS SOLUTIONS OF NICKEL FLUOBORATE AND NICKEL SULFATE AND AQUEOUS SOLUTIONS OF NICKEL SULFAMATE AND SAID ADDITION AGENT BEING SELECTED FROM THE CLASS CONSISTING OF COUMARIN AND ITS SUBSTITUTION PRODUCTS WHEREIN A SUBSTITUENT OF THE CALSS CONSISTING OF ALKYL RADICALS CONTAINING NOT MORE THAN FOUR CARBON ATOMS, ACYL RADICALS CONTAINING NOT MORE THAN 4 CARBON ATOMS, HALOTEN AND CARBOXYL GROUPS REPLACES A HYDROGEN ATOM OF THE COUMARIN, SUCH ADDITION AGENT BEING DISSOLVED IN SAID SOLUTION IN CONCENTRATION FROM 0.05 GRAM PER LITER TO SATURATION, SAID SOLUTION ALSO CONTAINING FROM 0.05 TO 1.5 GRAMS PER LITER OF FORMALDEHYDE.