Process for depositing an aluminum film on a substrate by thermal vaporization

Claim 1

THE PROCESS FOR THE DEPOSITION OF AN ALUMINUM FILM ON A SUBSTRATE BY THERMAL EVAPORATION OF MOLTEN ALUMINUM IN A VACUUM WHICH COMPRISES HEATING ALUMINUM TO A TEMPERATURE SUFFICIENTLY ABOVE ITS MELTING POINT TO EVAPORATE THE ALUMINUM, MAINTAINING AT THE INTERFACE BETWEEN DURING EVAPORATION, ON AN ELEMENTAL CARBON SUPPORT, AND MAINTAINING AT THE INTERFACE BETWEEN THE SUPPORT AND THE MOLTEN ALUMINUM A LAYER OF A CARBIDE OF A METAL TAKEN FROM THE CLASS CONSISTING OF TITANUM, ZIRCONIUM, HAFNIUM, VANADIUM, COLUMBIUM AND TANTALUM SO AS TO PREVENT UNDUE ATTACK OF THE ELEMENTAL CARBON SUPPORT BY THE MOLTEN ALUMINUM, SAID CARBIDE LAYER BEING FORMED BY CONTACTING SAID CARBON SUPPORT WITH A MATERIAL COMPRISING SAID CARBIDE-FORMING METAL WHILE SAID SUPPORT IS MAINTAINED AT A SUFFICIENTLY HIGH TEMPERATURE TO FORM THE CARBIDE LAYER.