Patent US2646616A successfully refreshed from Google Patents.
← Back to Patent Explorer
US2646616A Expired / Lapsed US ⏱️ 0.0 years remaining

Composite metal having precious metal surface and berylliumcopper base

Assignee: Metals and Controls Corp
•
Filing: 1949-09-06
•
Granted: 1953-07-28
•
Expires: 1969-09-06
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

No abstract record available.

Inventors

  • 👤 Ermand H Davignon

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-25 12:26
CPC Classifications
B; B32; B32B; B32B15/00; B32B15/01; B32B15/018; Y; Y10; Y10S; Y10S428/00; Y10S428/922; Y10S428/9335; Y10S428/939; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12771; Y10T428/12861; Y10T428/12868; Y10T428/12903; Y10T428/1291; Y10T428/12944; Y10T428/12986

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 125 words
A COMPOSITE CORROSION-RESISTANT LAMINATED METAL COMPRISING A BERYLLIUM-COPPER BASE LAYER, AN ANTI-OXIDANT PROTECTIVE METAL LAYER BONDED TO SAID BASE LAYER, A SOLDER LAYER BONDED TO SAID PROTECTIVE LAYER, A BARRIER METAL LAYER BONDED TO SAID SOLDER LAYER, A NICKEL LAYER BONDED TO SAID BARRIER METAL LAYER, AND A PRECIOUS METAL LAYER BONDED TO SAID NICKEL LAYER, SAID SOLDER LAYER HAVING A MELTING POINT EXCEEDING THE SOLUTION ANNEALING TEMPERATURE OF BERYLLIUM-COPPER, THE BONDS BETWEEN ADJACENT LAYERS REMAINING INTACT AT THE SOLUTION ANNEALING TEMPERATURE OF BERYLLIUM-COPPER, SAID BARRIER METAL BEING A SUBSTANTIALLY NON-FERROUS ALLOY CONTAINING PREDOMINANTLY ONE OF THE GROUP CONSISTING OF NICKEL AND COPPER, SAID BARRIER METAL BEING SOLDER-DIFFUSIBLE AND OF SUFFICIENT STRENGTH TO WITHSTAND THE LAYER SEPARATING FORCES AT THE SOLUTION ANNEALING TEMPERATURE OF BERYLLIUM-COPPER.
Claim 2
Dependent Claim 125 words
A COMPOSITE CORROSION-RESISTANT LAMINATED METAL COMPRISING A BERYLLIUM-COPPER BASE LAYER, AN ANTI-OXIDANT PROTECTIVE METAL LAYER BONDED TO SAID BASE LAYER, A SOLDER LAYER BONDED TO SAID PROTECTIVE LAYER, A BARRIER METAL LAYER BONDED TO SAID SOLDER LAYER, A NICKEL LAYER BONDED TO SAID BARRIER METAL LAYER, AND A PRECIOUS METAL LAYER BONDED TO SAID NICKEL LAYER, SAID SOLDER LAYER HAVING A MELTING POINT EXCEEDING THE SOLUTION ANNEALING TEMPERATURE OF BERYLLIUM-COPPER, THE BONDS BETWEEN ADJACENT LAYERS REMAINING INTACT AT THE SOLUTION ANNEALING TEMPERATURE OF BERYLLIUM-COPPER, SAID BARRIER METAL BEING A SUBSTANTIALLY NON-FERROUS ALLOY CONTAINING PREDOMINANTLY ONE OF THE GROUP CONSISTING OF NICKEL AND COPPER, SAID BARRIER METAL BEING SOLDER-DIFFUSIBLE AND OF SUFFICIENT STRENGTH TO WITHSTAND THE LAYER SEPARATING FORCES AT THE SOLUTION ANNEALING TEMPERATURE OF BERYLLIUM-COPPER.

References Cited (Backward Citations)

US2474038A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1956-07-27 1957-01-26 1957-07-28 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1960-07-27 1961-01-26 1961-07-28 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1964-07-27 1965-01-26 1965-07-28 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag