Patent US1207767A successfully refreshed from Google Patents.
Patent US2623273A successfully refreshed from Google Patents.
US2623273A
Expired / Lapsed
US
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Soldered joint and method of making same
Assignee: Indium Corp of America Inc
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Filing: 1945-05-05
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Granted: 1952-12-30
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Expires: 1965-05-05
Abstract
No abstract record available.
Inventors
- 👤 William S Murray
- 👤 Maria T Ludwick
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 18:50
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; B23K35/26; B23K35/268; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12701; Y10T428/12986
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
34 words
AN ARTICLE HAVING A SOLDERED JOINT IN WHICH ADJOINING SURFACES OF BASE METAL ARE BONDED TOGETHER SOLELY BY A SINGLE SOLDER ALLOY CONSISTING OF 3% SILVER, 1 TO 5% INDIUM AND THE BALANCE LEAD.
Claim 2
Dependent Claim
34 words
AN ARTICLE HAVING A SOLDERED JOINT IN WHICH ADJOINING SURFACES OF BASE METAL ARE BONDED TOGETHER SOLELY BY A SINGLE SOLDER ALLOY CONSISTING OF 3% SILVER, 1 TO 5% INDIUM AND THE BALANCE LEAD.
Claim 3
Independent Claim
86 words
A METHOD OF JOINING TWO OR MORE BASE METAL SURFACES IN A PREDETERMINED POSITION RELATIVE TO EACH OTHER WHICH CONSISTS ESSENTIALLY IN HEATING SAID SURFACES, APPLYING TO AT LEAST ONE OF SAID SURFACES A SINGLE SOLDER ALLOY CONSISTING OF 3% SILVER, 1 TO 5% INDIUM AND THE BALANCE LEAD, WETTING BOTH OF SAID SURFACES WITH THE SAID SOLDER IN MOLTEN FORM, AND COOLING SAID SURFACES AND SOLDER TO A TEMPERATURE BELOW THE MELTING POINT OF SAID SOLDER THEREBY CREATING A FIRM BOND BETWEEN SAID METAL SURFACES.
Claim 4
Independent Claim
86 words
A METHOD OF JOINING TWO OR MORE BASE METAL SURFACES IN A PREDETERMINED POSITION RELATIVE TO EACH OTHER WHICH CONSISTS ESSENTIALLY IN HEATING SAID SURFACES, APPLYING TO AT LEAST ONE OF SAID SURFACES A SINGLE SOLDER ALLOY CONSISTING OF 3% SILVER, 1 TO 5% INDIUM AND THE BALANCE LEAD, WETTING BOTH OF SAID SURFACES WITH THE SAID SOLDER IN MOLTEN FORM, AND COOLING SAID SURFACES AND SOLDER TO A TEMPERATURE BELOW THE MELTING POINT OF SAID SOLDER THEREBY CREATING A FIRM BOND BETWEEN SAID METAL SURFACES.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1955-12-30 | 1956-06-30 | 1956-12-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1959-12-30 | 1960-06-30 | 1960-12-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1963-12-30 | 1964-06-30 | 1964-12-30 | $7700.00 | Window Closed / Lapsed |