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US2623273A Expired / Lapsed US ⏱️ 0.0 years remaining

Soldered joint and method of making same

Assignee: Indium Corp of America Inc
•
Filing: 1945-05-05
•
Granted: 1952-12-30
•
Expires: 1965-05-05
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Abstract

No abstract record available.

Inventors

  • 👤 William S Murray
  • 👤 Maria T Ludwick

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-27 09:54
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; B23K35/26; B23K35/268; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12701; Y10T428/12986

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 34 words
AN ARTICLE HAVING A SOLDERED JOINT IN WHICH ADJOINING SURFACES OF BASE METAL ARE BONDED TOGETHER SOLELY BY A SINGLE SOLDER ALLOY CONSISTING OF 3% SILVER, 1 TO 5% INDIUM AND THE BALANCE LEAD.
Claim 2
Dependent Claim 34 words
AN ARTICLE HAVING A SOLDERED JOINT IN WHICH ADJOINING SURFACES OF BASE METAL ARE BONDED TOGETHER SOLELY BY A SINGLE SOLDER ALLOY CONSISTING OF 3% SILVER, 1 TO 5% INDIUM AND THE BALANCE LEAD.
Claim 3
Independent Claim 86 words
A METHOD OF JOINING TWO OR MORE BASE METAL SURFACES IN A PREDETERMINED POSITION RELATIVE TO EACH OTHER WHICH CONSISTS ESSENTIALLY IN HEATING SAID SURFACES, APPLYING TO AT LEAST ONE OF SAID SURFACES A SINGLE SOLDER ALLOY CONSISTING OF 3% SILVER, 1 TO 5% INDIUM AND THE BALANCE LEAD, WETTING BOTH OF SAID SURFACES WITH THE SAID SOLDER IN MOLTEN FORM, AND COOLING SAID SURFACES AND SOLDER TO A TEMPERATURE BELOW THE MELTING POINT OF SAID SOLDER THEREBY CREATING A FIRM BOND BETWEEN SAID METAL SURFACES.
Claim 4
Independent Claim 86 words
A METHOD OF JOINING TWO OR MORE BASE METAL SURFACES IN A PREDETERMINED POSITION RELATIVE TO EACH OTHER WHICH CONSISTS ESSENTIALLY IN HEATING SAID SURFACES, APPLYING TO AT LEAST ONE OF SAID SURFACES A SINGLE SOLDER ALLOY CONSISTING OF 3% SILVER, 1 TO 5% INDIUM AND THE BALANCE LEAD, WETTING BOTH OF SAID SURFACES WITH THE SAID SOLDER IN MOLTEN FORM, AND COOLING SAID SURFACES AND SOLDER TO A TEMPERATURE BELOW THE MELTING POINT OF SAID SOLDER THEREBY CREATING A FIRM BOND BETWEEN SAID METAL SURFACES.

References Cited (Backward Citations)

US1960740A Cited
US1934730A Cited
US2157933A Cited
US2220901A Cited
US2306667A Cited
US2464821A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1955-12-30 1956-06-30 1956-12-30 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1959-12-30 1960-06-30 1960-12-30 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1963-12-30 1964-06-30 1964-12-30 $7700.00 Window Closed / Lapsed

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