Patent US20040109299A1 successfully refreshed from Google Patents.
US20040109299A1
Expired / Lapsed
US
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Electronic array and methods for fabricating same
Assignee: General Electric Co
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Filing: 2002-12-06
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Granted: —
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Expires: 2022-12-06
Abstract
Abstract A sensor array includes a substrate including a front side and a back side, a plurality of transducers fabricated on the front side of the substrate, a plurality of input/output connections positioned on the back side of the substrate, the input/output connections electrically coupled to the transducers, at least one electronic device, and an interposer positioned between the substrate and the electronic device, the interposer including a multilayer interconnect system configured to electrically connect the input/output connections to the electronic device.
Inventors
- 👤 William Burdick
- 👤 James Rose
- 👤 Donna Sherman
- 👤 James Sabatini
- 👤 George Possin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 08:46
CPC Classifications
G; G01; G01T; G01T1/00; G01T1/29; G01T1/2914; G01T1/2921; G01T1/2928; H; H04; H04N; H04N25/00; H04N25/40; H04N25/41
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
102 words
1 . A tileable sensor array comprising: a substrate including a front side and a back side; a plurality of transducers fabricated on said first side of said substrate; a plurality of input/output connections positioned on said second side of said substrate, said input/output connections electrically coupled to said transducers; at least one electronic device; and a flexible printed circuit board removably coupled to said substrate and said electronic device, said electronic device configured to transmit signals to said plurality of transducers fabricated on said substrate first side, and receive signals from said plurality of transducers fabricated on said substrate first side.
Claim 2
Dependent Claim
102 words
1 . A tileable sensor array comprising: a substrate including a front side and a back side; a plurality of transducers fabricated on said first side of said substrate; a plurality of input/output connections positioned on said second side of said substrate, said input/output connections electrically coupled to said transducers; at least one electronic device; and a flexible printed circuit board removably coupled to said substrate and said electronic device, said electronic device configured to transmit signals to said plurality of transducers fabricated on said substrate first side, and receive signals from said plurality of transducers fabricated on said substrate first side.
Claim 3
Dependent Claim
35 words
2 . A tileable sensor array in accordance with claim 1 wherein said plurality of transducers comprise at least one of a back-illuminated photodiode, a sonic sensor, a temperature sensor, and an electromagnetic radiation sensor.
Claim 4
Dependent Claim
22 words
3 . A tileable sensor array in accordance with claim 1 wherein said flexible printed circuit board includes an approximately ninety-degree bend.
Claim 5
Dependent Claim
26 words
4 . A tileable sensor array in accordance with claim 1 wherein said electronic device comprises at least one signal processor electrically coupled to said transducer.
Claim 6
Dependent Claim
61 words
5 . A tileable sensor array in accordance with claim 1 further comprising an interposer positioned between said substrate and said electronic device, said interposer comprising a multilayer interconnect system configured to electrically connect said input/output connections to said electronic device, said interposer fabricated from a material comprising at least one of a polyimide, an aramid, a fluorocarbon, and a polyester.
Claim 7
Dependent Claim
34 words
6 . A tileable sensor array in accordance with claim 5 wherein said interposer is removably coupled to said input/output connections, and said at least one electronic device is removably coupled to said interposer.
Claim 8
Dependent Claim
38 words
7 . A tileable sensor array in accordance with claim 5 wherein said interposer comprises a first side and a second side, wherein said first side comprises a plurality of electrical connectors electrically coupled to said input/output connectors.
Claim 9
Dependent Claim
94 words
8 . A tileable sensor array comprising: a substrate including a front side and a back side; a plurality of transducers fabricated on said front side of said substrate; a plurality of input/output connections positioned on said back side of said substrate, said input/output connections electrically coupled to said transducers; at least one electronic device comprising at least one signal processor circuit; and a flexible metal-on-polyimide interposer positioned between said substrate and said electronic device, said flexible interposer comprising a multilayer interconnect system configured to electrically connect said input/output connections to said electronic device.
Claim 10
Dependent Claim
94 words
8 . A tileable sensor array comprising: a substrate including a front side and a back side; a plurality of transducers fabricated on said front side of said substrate; a plurality of input/output connections positioned on said back side of said substrate, said input/output connections electrically coupled to said transducers; at least one electronic device comprising at least one signal processor circuit; and a flexible metal-on-polyimide interposer positioned between said substrate and said electronic device, said flexible interposer comprising a multilayer interconnect system configured to electrically connect said input/output connections to said electronic device.
Claim 11
Dependent Claim
69 words
9 . A tileable sensor array kit comprising: an interchangeable transistor array; at least one removable signal processor circuit; a first flexible interchangeable multilayer interconnect system positioned between said interchangeable transistor array and said signal processor circuit; and a second flexible interchangeable multilayer interconnect system positioned between said interchangeable transistor array and said signal processor circuit; said first multilayer interconnect system configured differently than said second multilayer interconnect system.
Claim 12
Dependent Claim
69 words
9 . A tileable sensor array kit comprising: an interchangeable transistor array; at least one removable signal processor circuit; a first flexible interchangeable multilayer interconnect system positioned between said interchangeable transistor array and said signal processor circuit; and a second flexible interchangeable multilayer interconnect system positioned between said interchangeable transistor array and said signal processor circuit; said first multilayer interconnect system configured differently than said second multilayer interconnect system.
Claim 13
Dependent Claim
30 words
10 . A tileable sensor array kit in accordance with claim 9 wherein said sensor array comprises an imaging array, and said plurality of transducers comprise a plurality of photodiodes.
Claim 14
Dependent Claim
27 words
11 . A tileable sensor array kit in accordance with claim 9 wherein said electronic device comprises at least one signal processor electrically coupled to said transducer.
Claim 15
Dependent Claim
34 words
12 . A tileable sensor array kit in accordance with claim 9 wherein said interposer is fabricated from a material comprising at least one of a polyimide, an aramid, a fluorocarbon, and a polyester.
Claim 16
Dependent Claim
59 words
13 . A tileable sensor array kit in accordance with claim 9 wherein said removable signal processor circuit comprises a first electrical connector positioned on an edge of said removable signal processor circuit, said first electrical connector configured to electrically couple to said interposer second side such that said removable signal processor circuit is substantially perpendicular to said interposer.
Claim 17
Dependent Claim
79 words
14 . A method for fabricating a tileable sensor array, said method comprising: fabricating a plurality of transducers on a front side of a substrate; fabricating a plurality of input/output connections on a back side of the substrate, such that the input/output connections are electrically coupled to the transducers; and positioning an interposer between the substrate and an electronic device; wherein the interposer comprises a multilayer interconnect system configured to electrically connect the input/output connections to the electronic device.
Claim 18
Dependent Claim
79 words
14 . A method for fabricating a tileable sensor array, said method comprising: fabricating a plurality of transducers on a front side of a substrate; fabricating a plurality of input/output connections on a back side of the substrate, such that the input/output connections are electrically coupled to the transducers; and positioning an interposer between the substrate and an electronic device; wherein the interposer comprises a multilayer interconnect system configured to electrically connect the input/output connections to the electronic device.
Claim 19
Dependent Claim
33 words
15 . A method for fabricating a tileable sensor array in accordance with claim 14 wherein the sensor array comprises an imaging array, and the plurality of transducers comprise a plurality of photodiodes.
Claim 20
Dependent Claim
30 words
16 . A method for fabricating a tileable sensor array in accordance with claim 14 wherein the electronic device comprises at least one signal processor electrically coupled to the transducer.
Claim 21
Dependent Claim
39 words
17 . A method for fabricating a tileable sensor array in accordance with claim 14 wherein the interposer is flexible and fabricated from a material comprising at least one of a polyimide, an aramid, a fluorocarbon, and a polyester.
Claim 22
Dependent Claim
38 words
18 . A method for fabricating a tileable sensor array in accordance with claim 14 wherein the interposer is removably coupled to the input/output connections, and the at least one electronic device is removably coupled to the interposer.
Claim 23
Dependent Claim
42 words
19 . A method for fabricating a tileable sensor array in accordance with claim 14 wherein the interposer comprises a first side and a second side, wherein the first side comprises a plurality of electrical connectors electrically coupled to the input/output connectors.
Claim 24
Dependent Claim
56 words
20 . A method for fabricating a tileable sensor array in accordance with claim 19 wherein the electronic device comprises a first electrical connector positioned on an edge of the electronic device, the first electrical connector configured to electrically couple to the interposer second side such that the electronic device is substantially perpendicular to the interposer.
Claim 25
Dependent Claim
54 words
21 . A tileable sensor array kit comprising: a first interchangeable substrate comprising a plurality of sensors; a second interchangeable substrate comprising a plurality of transmitters; a flexible interchangeable multilayer interconnect system positioned between at least one of said interchangeable substrate and said second interchangeable substrate; and at least one removable signal processor circuit.
Claim 26
Dependent Claim
54 words
21 . A tileable sensor array kit comprising: a first interchangeable substrate comprising a plurality of sensors; a second interchangeable substrate comprising a plurality of transmitters; a flexible interchangeable multilayer interconnect system positioned between at least one of said interchangeable substrate and said second interchangeable substrate; and at least one removable signal processor circuit.
Claim 27
Dependent Claim
22 words
22 . A tileable sensor array kit in accordance with claim 21 wherein said plurality of transmitters comprises a plurality of photodiodes.
Claim 28
Dependent Claim
34 words
23 . A tileable sensor array kit in accordance with claim 21 wherein said electronic device comprises at least one signal processor electrically coupled to at least one of said sensors and said transmitters.
Claim 29
Dependent Claim
38 words
24 . A tileable sensor array kit in accordance with claim 21 wherein said flexible interchangeable multilayer interconnect system is fabricated from a material comprising at least one of a polyimide, an aramid, a fluorocarbon, and a polyester.
Claim 30
Dependent Claim
59 words
25 . A tileable sensor array kit in accordance with claim 21 wherein said removable signal processor circuit comprises a first electrical connector positioned on an edge of said removable signal processor circuit, said first electrical connector configured to electrically couple to said interposer second side such that said removable signal processor circuit is substantially perpendicular to said interposer.
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