Patent US1187970A successfully refreshed from Google Patents.
Patent US20020172016A1 successfully refreshed from Google Patents.
US20020172016A1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flat mount with at least one semiconductor chip
Assignee: Individual
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Filing: 2002-05-28
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Granted: —
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Expires: 2022-05-28
Abstract
Abstract The flat mount assembly, or transponder, has at least one semiconductor chip that is connected to an antenna for interchanging data and power with an electronic apparatus. The antenna is formed of two electrical conductors. A conductive layer is formed on the mount in overlapping relationship with the electrical conductors of the antenna. The overlapping conductive layer results in greater capacitive coupling between the electronic apparatus and the flat mount assembly.
Inventors
- 👤 Robert Reiner
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:30
CPC Classifications
H; H10; H10D; H10D99/00; G; G07; G07D; G07D7/00; G07D7/02; G07D7/026; G07D7/01
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
62 words
1 . A flat mount assembly, comprising a flat mount, at least one semiconductor chip in or on said flat mount, an antenna formed of two electrical conductors connected to said at least one semiconductor chip for interchanging data and power with an electronic apparatus, and a conductive layer disposed on said mount and overlapping with said electrical conductors of said antenna.
Claim 2
Dependent Claim
62 words
1 . A flat mount assembly, comprising a flat mount, at least one semiconductor chip in or on said flat mount, an antenna formed of two electrical conductors connected to said at least one semiconductor chip for interchanging data and power with an electronic apparatus, and a conductive layer disposed on said mount and overlapping with said electrical conductors of said antenna.
Claim 3
Dependent Claim
25 words
2 . The flat mount assembly according to claim 1 , wherein each of said two electrical conductors overlaps with an associated said conductive layer.
Claim 4
Dependent Claim
24 words
3 . The flat mount assembly according to claim 2 , wherein a respective said conductive layer completely covers a respective said electrical conductor.
Claim 5
Dependent Claim
34 words
4 . The flat mount assembly according to claim 1 , which further comprises a dielectric, and wherein said conductive layer is located at a distance from said electrical conductors, separated by said dielectric.
Claim 6
Dependent Claim
26 words
5 . The flat mount assembly according to claim 1 , wherein said electrical conductors are embedded together with said semiconductor chip in said flat mount.
Claim 7
Dependent Claim
31 words
6 . The flat mount assembly according to claim 1 , wherein said flat mount has a first main face and said electrical conductors are applied on said first main face.
Claim 8
Dependent Claim
24 words
7 . The flat mount assembly according to claim 1 , wherein said conductive layer is in direct electrical contact with said electrical conductors.
Claim 9
Dependent Claim
24 words
8 . The flat mount assembly according to claim 1 , wherein said conductive layer is arranged mirror-symmetrically with respect to said electrical conductors.
Claim 10
Dependent Claim
24 words
9 . The flat mount assembly according to claim 1 , wherein said electrical conductors are arranged symmetrically with respect to said semiconductor chip.
Claim 11
Dependent Claim
25 words
10 . The flat mount assembly according to claim 1 , wherein said semiconductor chip is disposed outside a mirror-image axis of said flat mount.
Claim 12
Dependent Claim
19 words
11 . The flat mount assembly according to claim 1 , wherein said flat mount is composed of paper.
Claim 13
Dependent Claim
33 words
12 . The flat mount assembly according to claim 1 , wherein a surface area of a respective said conductive layer is greater than a surface acrea of a respective said electrical conductor.
References Cited (Backward Citations)
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